Electronic failure analysis handbook Techniques and applications for electronic and electrical packages, components, and assemblllies

Bibliographic Details
Other Authors: Martin
Format: Book
Language:English
Published: New York Mc Graw Hill 1999
Series:Electronic packaging and interconnection series
Subjects:

KEMENTAH

Holdings details from KEMENTAH
Call Number: 621 381 ELE R 1999
Accession Item Category Format Status Notes
0191742 Rujukan BOOKS AVAILABLE