High speed end milling of single crystal silicon wafer

Presently, silicon is the most important semiconducting material used in the electronic industry. Silicon has also found application in energy and mechanical application such as electro-optics and micro-electro mechanical system (MEMS) devices. The process of machining silicon requires high quality...

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Main Authors:	Amin, A. K. M. Nurul, Musa, Mohd Dali
Format:	Book
Language:	English
Published:	LAP Lambert Academic Publishing 2011
Subjects:	TS Manufactures
Online Access:	http://irep.iium.edu.my/17634/ http://irep.iium.edu.my/17634/ http://irep.iium.edu.my/17634/1/Silicon_Machining.pdf

id	iium-17634
recordtype	eprints
spelling	iium-176342015-11-24T07:53:07Z http://irep.iium.edu.my/17634/ High speed end milling of single crystal silicon wafer Amin, A. K. M. Nurul Musa, Mohd Dali TS Manufactures Presently, silicon is the most important semiconducting material used in the electronic industry. Silicon has also found application in energy and mechanical application such as electro-optics and micro-electro mechanical system (MEMS) devices. The process of machining silicon requires high quality surface finish and is generally achieved through processes such as grinding, polishing and lapping. In this experimental work, high speed end-milling has been suggested as an alternative to the traditional finishing process. There are a number of technological barriers which high speed end-milling must overcome for it to be able to machine silicon. Crack free surface and continuous chip should be form during machining which can only be obtained in ductile regime machining. In ductile regime machining, the surface is smooth, where as in the brittle regime, there are surface cracks. Ductile regime machining of silicon is hard to obtain due to the brittle properties of silicon and hardness of tool materials. Prior research shows that ductile mode of machining is possible under controlled machining conditions. Various parameters such as cutting speed, depth of cut and rake angle show effect on ductile mode machining of silicon. In this perspective, obtaining the right machining parameters to machine silicon plays an important role to obtain ductile mode machining. LAP Lambert Academic Publishing 2011 Book PeerReviewed application/pdf en http://irep.iium.edu.my/17634/1/Silicon_Machining.pdf Amin, A. K. M. Nurul and Musa, Mohd Dali (2011) High speed end milling of single crystal silicon wafer. LAP Lambert Academic Publishing, USA, UK. ISBN 978-3-8443-8111-5 https://www.lap-publishing.com/
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TS Manufactures
spellingShingle	TS Manufactures Amin, A. K. M. Nurul Musa, Mohd Dali High speed end milling of single crystal silicon wafer
description	Presently, silicon is the most important semiconducting material used in the electronic industry. Silicon has also found application in energy and mechanical application such as electro-optics and micro-electro mechanical system (MEMS) devices. The process of machining silicon requires high quality surface finish and is generally achieved through processes such as grinding, polishing and lapping. In this experimental work, high speed end-milling has been suggested as an alternative to the traditional finishing process. There are a number of technological barriers which high speed end-milling must overcome for it to be able to machine silicon. Crack free surface and continuous chip should be form during machining which can only be obtained in ductile regime machining. In ductile regime machining, the surface is smooth, where as in the brittle regime, there are surface cracks. Ductile regime machining of silicon is hard to obtain due to the brittle properties of silicon and hardness of tool materials. Prior research shows that ductile mode of machining is possible under controlled machining conditions. Various parameters such as cutting speed, depth of cut and rake angle show effect on ductile mode machining of silicon. In this perspective, obtaining the right machining parameters to machine silicon plays an important role to obtain ductile mode machining.
format	Book
author	Amin, A. K. M. Nurul Musa, Mohd Dali
author_facet	Amin, A. K. M. Nurul Musa, Mohd Dali
author_sort	Amin, A. K. M. Nurul
title	High speed end milling of single crystal silicon wafer
title_short	High speed end milling of single crystal silicon wafer
title_full	High speed end milling of single crystal silicon wafer
title_fullStr	High speed end milling of single crystal silicon wafer
title_full_unstemmed	High speed end milling of single crystal silicon wafer
title_sort	high speed end milling of single crystal silicon wafer
publisher	LAP Lambert Academic Publishing
publishDate	2011
url	http://irep.iium.edu.my/17634/ http://irep.iium.edu.my/17634/ http://irep.iium.edu.my/17634/1/Silicon_Machining.pdf
first_indexed	2023-09-18T20:26:35Z
last_indexed	2023-09-18T20:26:35Z
_version_	1777408457787310080

High speed end milling of single crystal silicon wafer

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