Mridha, S., & Law, S. B. (2011). Influences of additives on copper film quality and gap filling capability of plating process. IIUM Press.
Chicago Style (17th ed.) CitationMridha, Shahjahan, and Shao Beng Law. Influences of Additives on Copper Film Quality and Gap Filling Capability of Plating Process. IIUM Press, 2011.
MLA (8th ed.) CitationMridha, Shahjahan, and Shao Beng Law. Influences of Additives on Copper Film Quality and Gap Filling Capability of Plating Process. IIUM Press, 2011.
Warning: These citations may not always be 100% accurate.