Influences of additives on copper film quality and gap filling capability of plating process

Bibliographic Details
Main Authors: Mridha, Shahjahan, Law, Shao Beng
Format: Book Chapter
Language:English
Published: IIUM Press 2011
Subjects:
Online Access:http://irep.iium.edu.my/19353/
http://irep.iium.edu.my/19353/
http://irep.iium.edu.my/19353/1/chp6.pdf
Description
Description not available.