Design and modeling of silicon MEMS accelerometer
In developing Micro Electro Mechanical Systems (MEMS), Finite Element Analysis (FEA) is usually relied upon to study these micro-structures in determining stress, deformation, resonance, temperature distribution, electromagnetic interference, and electrical properties. With this kind of approach, th...
| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2011
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/2052/ http://irep.iium.edu.my/2052/1/ICMAAE-11-188.pdf |
| Summary: | In developing Micro Electro Mechanical Systems (MEMS), Finite Element Analysis (FEA) is usually relied upon to study these micro-structures in determining stress, deformation, resonance, temperature distribution, electromagnetic interference, and electrical properties. With this kind of approach, the performance of the devices can be easily expanded, as well as reducing the time and cost of MEMS production. This paper focuses on the modeling of silicon MEMS accelerometer in an attempt to design a surface micro-machined accelerometer that satisfies certain pre-determined specifications.
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