Mould design for handphone casing using moldflow

Mould design for handphone casing using moldflow

Bibliographic Details
Main Authors:	Mohamed Ariff, Tasnim Firdaus, Law, Siah Yong
Format:	Book Chapter
Language:	English
Published:	IIUM Press 2011
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/21330/ http://irep.iium.edu.my/21330/ http://irep.iium.edu.my/21330/1/3.pdf

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