Fabricating micromilling tool using wire electrodischarge grinding and focused ion beam sputtering
This paper discusses the microfabrication of micromilling tools using wire electrodischarge grinding (WEDG) and focused ion beam (FIB) sputtering. The tool blank of tungsten carbide was produced by WEDG and the cutting edges were formed by FIB sputtering. Using these two complementary processes...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Springer
2006
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/27106/ http://irep.iium.edu.my/27106/1/018_IJAMT_31%285-6%29_501-508.pdf |
| Summary: | This paper discusses the microfabrication of
micromilling tools using wire electrodischarge grinding
(WEDG) and focused ion beam (FIB) sputtering. The tool
blank of tungsten carbide was produced by WEDG and the
cutting edges were formed by FIB sputtering. Using these
two complementary processes micromilling tools were
fabricated with submicrometer accuracy and nanometric
levelled surface finish. The fabricated microtools were
used to mill microchannels on polymer. The fabricated
microtool and microchannels were inspected using an
optical surface profiler, atomic force microscope (AFM)
and scanning electron microscope (SEM). The length of
the microchannels ranges from 0.5 mm to 2 mm. The
maximum trench depth was 5μm. The widths of the
channels were about 10–20% larger than the tool diameter
when milling without and with lubrication, respectively. An
average surface finish of 80 nm was achieved. |
|---|