MEMS and EFF technology based micro connector for future miniature devices

The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and...

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Main Authors:	Bhuiyan, Moinul, Alamgir, Tarik, Bhuiyan, Munira, Kajihara, Masanori
Format:	Article
Language:	English
Published:	IOP Publishing 2013
Subjects:	TA401 Materials of engineering and construction
Online Access:	http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf

id	iium-34443
recordtype	eprints
spelling	iium-344432014-07-03T07:43:03Z http://irep.iium.edu.my/34443/ MEMS and EFF technology based micro connector for future miniature devices Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori TA401 Materials of engineering and construction The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique. IOP Publishing 2013 Article PeerReviewed application/pdf en http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf Bhuiyan, Moinul and Alamgir, Tarik and Bhuiyan, Munira and Kajihara, Masanori (2013) MEMS and EFF technology based micro connector for future miniature devices. IOP Conference Series: Materials Science and Engineering, 53. 012063-1. ISSN 1757-8981 http://iopscience.iop.org/1757-899X/53/1/012063 10.1088/1757-899X/53/1/012063
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA401 Materials of engineering and construction
spellingShingle	TA401 Materials of engineering and construction Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori MEMS and EFF technology based micro connector for future miniature devices
description	The development of a miniature; size, light and high performance electronic devices; has been accelerated for further development. In commercial stamping method, connector pitch size (radius) is more than 300μm due to its size limitation. Therefore, the stamped contact hertz stress becomes lower and less suitable for fine pitch connector. To overcome this pitch size problem a narrow pitch Board-to-Board (BtoB) interface connectors are in demand for the current commercial design. Therefore, this paper describes a fork type micro connector design with high Hertz-Stress using MEMS and Electro Fine Forming (EFF) fabrication techniques. The connector is designed high aspect ratio and high-density packaging using UV thick resist and electroforming. In this study a newly fabricated micro connector’s maximum aspect ratio is 50μm and pitch is 80μm is designed successfully which is most compact fork-type connector in the world. When these connectors are connected, a contact resistance of less than 50mΩ has been attained by using four-point probe technique.
format	Article
author	Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori
author_facet	Bhuiyan, Moinul Alamgir, Tarik Bhuiyan, Munira Kajihara, Masanori
author_sort	Bhuiyan, Moinul
title	MEMS and EFF technology based micro connector for future miniature devices
title_short	MEMS and EFF technology based micro connector for future miniature devices
title_full	MEMS and EFF technology based micro connector for future miniature devices
title_fullStr	MEMS and EFF technology based micro connector for future miniature devices
title_full_unstemmed	MEMS and EFF technology based micro connector for future miniature devices
title_sort	mems and eff technology based micro connector for future miniature devices
publisher	IOP Publishing
publishDate	2013
url	http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/ http://irep.iium.edu.my/34443/1/MEMS_and_EFF_technology_based_micro_connector_for_future_miniature_devices.pdf
first_indexed	2023-09-18T20:49:38Z
last_indexed	2023-09-18T20:49:38Z
_version_	1777409907651248128

MEMS and EFF technology based micro connector for future miniature devices

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