Experimental and numerical analysis of electronics heat sink
Cooling of electronic components continues to attract many research and development activities towards achieving an effective way of cooling. Computational fluid dynamics (CFD) tools may be considered as a cheap substitute for expensive experimental testing methods. In this work the cooling of a sim...
Main Authors: | Ismail, Ahmad Faris, Ahmed, Mirghani Ishak, Abakrb, Yousif A. |
---|---|
Format: | Article |
Language: | English |
Published: |
IIUM Press
2002
|
Subjects: | |
Online Access: | http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/ http://irep.iium.edu.my/36908/1/IIUM_Journal_Heat_Sink_2002.pdf |
Similar Items
-
Numerical investigation of flow boiling in double-layer microchannel heat sink
by: Ahmed, Shugata, et al.
Published: (2014) -
Mixed-convection heat transfer from simulated air-cooled electronic devices: experimental and numerical study
by: Hrairi, Meftah, et al.
Published: (2010) -
Two-phase fin-induced turbulent cooling for electronic devices using heat pump associated micro-gap Heat Sink
by: Ahmed, Shugata, et al.
Published: (2018) -
Numerical study of heat transfer augmentation using pulse
jet impinging on Pin Fin heat sink
by: Siddique, Mohd Umair, et al.
Published: (2019) -
Experimental and numerical
investigation of heat transfer in CNT
nanofluids
by: Rashmi, Walvekar, et al.
Published: (2015)