Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating

Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be...

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Main Authors:	Rasheed, Aous Naji, Abdul Muthalif, Asan Gani, Saleh, Tanveer
Format:	Conference or Workshop Item
Language:	English English
Published:	2014
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/37351/ http://irep.iium.edu.my/37351/ http://irep.iium.edu.my/37351/1/ICOMM_2014_aous.pdf http://irep.iium.edu.my/37351/2/ICOMM_2014_proof.pdf

id	iium-37351
recordtype	eprints
spelling	iium-373512015-01-12T15:22:35Z http://irep.iium.edu.my/37351/ Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer T Technology (General) Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. In this method, initially Si workpiece is coated with a conductive material (gold for this study) and then -WEDM operation is carried out. Finally, after WEDM operation, the conductive layer is removed from the polished Si substrate without damaging the substrate. WEDM process stability was found to be improved (up to 60 times for certain machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate was also found to be increased by a good margin (~ 100% maximum) for coated Si wafer. Overall this new method of -WEDM operation of polished Si wafer has been found to be more efficient and useful. 2014 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/37351/1/ICOMM_2014_aous.pdf application/pdf en http://irep.iium.edu.my/37351/2/ICOMM_2014_proof.pdf Rasheed, Aous Naji and Abdul Muthalif, Asan Gani and Saleh, Tanveer (2014) Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating. In: 9th International Conference on MicroManufacturing (ICOMM 2014), 25 - 28 Mar 2014, Singapore. http://minds.wisconsin.edu/handle/1793/68989?show=full
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English
topic	T Technology (General)
spellingShingle	T Technology (General) Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
description	Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be applied for semiconductor material like Silicon (Si). In this paper a new approach is proposed for machining polished Si (p-type, resistivity 1-50 -cm) wafer. In this method, initially Si workpiece is coated with a conductive material (gold for this study) and then -WEDM operation is carried out. Finally, after WEDM operation, the conductive layer is removed from the polished Si substrate without damaging the substrate. WEDM process stability was found to be improved (up to 60 times for certain machining condition) if coated Si wafer is used as compared to uncoated Si workpiece. Material removal rate was also found to be increased by a good margin (~ 100% maximum) for coated Si wafer. Overall this new method of -WEDM operation of polished Si wafer has been found to be more efficient and useful.
format	Conference or Workshop Item
author	Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer
author_facet	Rasheed, Aous Naji Abdul Muthalif, Asan Gani Saleh, Tanveer
author_sort	Rasheed, Aous Naji
title	Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
title_short	Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
title_full	Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
title_fullStr	Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
title_full_unstemmed	Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
title_sort	improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating
publishDate	2014
url	http://irep.iium.edu.my/37351/ http://irep.iium.edu.my/37351/ http://irep.iium.edu.my/37351/1/ICOMM_2014_aous.pdf http://irep.iium.edu.my/37351/2/ICOMM_2014_proof.pdf
first_indexed	2023-09-18T20:53:36Z
last_indexed	2023-09-18T20:53:36Z
_version_	1777410156801294336

Improving μ-wire electro-discharge machining operation of polished silicon wafer by conductive coating

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