Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching

In this paper, a simple microcantilever release process using anisotropic wet etching is presented. The microcantilever release is conducted at the final stage of the fabrication of piezoresistive microcantilever sensor. Issues related to microcantilever release such as microscopic roughness and mac...

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Main Authors:	Ab Rahim, Rosminazuin, Bais, Badariah, Yeop Majlis, Burhanuddin
Format:	Article
Language:	English
Published:	Trans Tech Publications Ltd., Switzerland 2014
Subjects:	T Technology (General)
Online Access:	http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/1/applied_mechanics_and_materials.pdf

id	iium-38849
recordtype	eprints
spelling	iium-388492018-06-25T00:43:24Z http://irep.iium.edu.my/38849/ Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching Ab Rahim, Rosminazuin Bais, Badariah Yeop Majlis, Burhanuddin T Technology (General) In this paper, a simple microcantilever release process using anisotropic wet etching is presented. The microcantilever release is conducted at the final stage of the fabrication of piezoresistive microcantilever sensor. Issues related to microcantilever release such as microscopic roughness and macroscopic roughness has been resolved using simple technique. By utilizing silicon oxide (SiO2) as the etch stop for the wet etching process, issues related to microscopic roughness can be eliminated. On the other hand, proper etching procedure with constant stirring of the etchant solution of KOH anisotropic etching significantly reduces the notching effect contributed by the macroscopic roughness. Upon the completion of microcantilever release, suspended microcantilever of 2µm thick is realized with the removal of SiO2 layer using Buffered Oxide Etching (BOE). Trans Tech Publications Ltd., Switzerland 2014 Article PeerReviewed application/pdf en http://irep.iium.edu.my/38849/1/applied_mechanics_and_materials.pdf Ab Rahim, Rosminazuin and Bais, Badariah and Yeop Majlis, Burhanuddin (2014) Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching. Applied Mechanics and Materials, 60. pp. 894-898. ISSN 1660-9336 http://www.scientific.net 10.4028/www.scientific.net/AMM.660.894
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	T Technology (General)
spellingShingle	T Technology (General) Ab Rahim, Rosminazuin Bais, Badariah Yeop Majlis, Burhanuddin Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
description	In this paper, a simple microcantilever release process using anisotropic wet etching is presented. The microcantilever release is conducted at the final stage of the fabrication of piezoresistive microcantilever sensor. Issues related to microcantilever release such as microscopic roughness and macroscopic roughness has been resolved using simple technique. By utilizing silicon oxide (SiO2) as the etch stop for the wet etching process, issues related to microscopic roughness can be eliminated. On the other hand, proper etching procedure with constant stirring of the etchant solution of KOH anisotropic etching significantly reduces the notching effect contributed by the macroscopic roughness. Upon the completion of microcantilever release, suspended microcantilever of 2µm thick is realized with the removal of SiO2 layer using Buffered Oxide Etching (BOE).
format	Article
author	Ab Rahim, Rosminazuin Bais, Badariah Yeop Majlis, Burhanuddin
author_facet	Ab Rahim, Rosminazuin Bais, Badariah Yeop Majlis, Burhanuddin
author_sort	Ab Rahim, Rosminazuin
title	Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
title_short	Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
title_full	Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
title_fullStr	Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
title_full_unstemmed	Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
title_sort	simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching
publisher	Trans Tech Publications Ltd., Switzerland
publishDate	2014
url	http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/ http://irep.iium.edu.my/38849/1/applied_mechanics_and_materials.pdf
first_indexed	2023-09-18T20:55:49Z
last_indexed	2023-09-18T20:55:49Z
_version_	1777410296137121792

Simple microcantilever release process of silicon piezoresistive microcantilever sensor using wet etching

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