$Fatigue fracture process of lead-free solder joints in BGA package$

Fatigue fracture process of lead-free solder joints in BGA package

Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same...

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Main Authors:	Tamin, M.N., Shaffiar, Norhashimah, Z., B. Lai, W., K. Loh
Format:	Book Chapter
Language:	English
Published:	Nova Science Publishers 2012
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/1/39020.pdf

id	iium-39020
recordtype	eprints
spelling	iium-390202015-05-14T01:47:13Z http://irep.iium.edu.my/39020/ Fatigue fracture process of lead-free solder joints in BGA package Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh TA349 Mechanics of engineering. Applied mechanics Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same time proposes solutions. The effect of fracture on the structure of nano-catalyst and diamond-like carbon coating de-lamination are some of the microscopical research covered in this book. The format of this book is such that the reader can use each chapter independently. It starts with the first chapter outlining the classical review that traces back to early fracture mechanics. It is then continued to broader ranges from experimental and commercial software implementation, to the formulation and implementation of XFEM and piezoelectricity problems. (Imprint: Nova) Nova Science Publishers 2012 Book Chapter PeerReviewed application/pdf en http://irep.iium.edu.my/39020/1/39020.pdf Tamin, M.N. and Shaffiar, Norhashimah and Z., B. Lai and W., K. Loh (2012) Fatigue fracture process of lead-free solder joints in BGA package. In: Recent trends in fracture mechanics. Materials Science and Technologies, Mechanical Engineering Theory and Applications . Nova Science Publishers, pp. 247-268. ISBN 978-1-61470-615-1 https://www.novapublishers.com/catalog/product_info.php?products_id=27439
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA349 Mechanics of engineering. Applied mechanics
spellingShingle	TA349 Mechanics of engineering. Applied mechanics Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh Fatigue fracture process of lead-free solder joints in BGA package
description	Book Description: Since the development of linear elastic fracture mechanics (LEFM) decades ago, its limitations have been discussed extensively. Methods of manipulation on how to overcome the problems have been proposed by many enthusiasts. This book also highlights the limitation and at the same time proposes solutions. The effect of fracture on the structure of nano-catalyst and diamond-like carbon coating de-lamination are some of the microscopical research covered in this book. The format of this book is such that the reader can use each chapter independently. It starts with the first chapter outlining the classical review that traces back to early fracture mechanics. It is then continued to broader ranges from experimental and commercial software implementation, to the formulation and implementation of XFEM and piezoelectricity problems. (Imprint: Nova)
format	Book Chapter
author	Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh
author_facet	Tamin, M.N. Shaffiar, Norhashimah Z., B. Lai W., K. Loh
author_sort	Tamin, M.N.
title	Fatigue fracture process of lead-free solder joints in BGA package
title_short	Fatigue fracture process of lead-free solder joints in BGA package
title_full	Fatigue fracture process of lead-free solder joints in BGA package
title_fullStr	Fatigue fracture process of lead-free solder joints in BGA package
title_full_unstemmed	Fatigue fracture process of lead-free solder joints in BGA package
title_sort	fatigue fracture process of lead-free solder joints in bga package
publisher	Nova Science Publishers
publishDate	2012
url	http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/ http://irep.iium.edu.my/39020/1/39020.pdf
first_indexed	2023-09-18T20:56:03Z
last_indexed	2023-09-18T20:56:03Z
_version_	1777410310884294656

Fatigue fracture process of lead-free solder joints in BGA package

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