Yamin, A., Shaffiar, N., Loh, W., & Tamin, M. (2012). Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects.
Chicago Style (17th ed.) CitationYamin, A.F.M, N.M Shaffiar, W.K Loh, and M.N Tamin. Extended Cohesive Zone Model for Simulation of Solder/IMC Interface Cyclic Damage Process in Pb-free Solder Interconnects. 2012.
MLA (8th ed.) CitationYamin, A.F.M, et al. Extended Cohesive Zone Model for Simulation of Solder/IMC Interface Cyclic Damage Process in Pb-free Solder Interconnects. 2012.
Warning: These citations may not always be 100% accurate.