APA (7th ed.) Citation

Yamin, A., Shaffiar, N., Loh, W., & Tamin, M. (2011). Damage progression in BGA solder joints during board-level drop test.

Chicago Style (17th ed.) Citation

Yamin, A.F.M, Norhashimah Shaffiar, W.K Loh, and M.N Tamin. Damage Progression in BGA Solder Joints During Board-level Drop Test. 2011.

MLA (8th ed.) Citation

Yamin, A.F.M, et al. Damage Progression in BGA Solder Joints During Board-level Drop Test. 2011.