Continuum damage evolution in pb-free solder joint under shear fatigue loadings

Progressive materials damage process in solder joint under cyclic shear deformation is examined in this study. A 3-D finite element model of a single reflowed SAC405 solder specimen is developed for this purpose. Cyclic relative displacement cycles between zero and 1.0 mm at displacement ramp r...

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Main Authors:	Shaffiar, Norhashimah, Loh, W.K., Kamsah, N., Tamin, M.N.
Format:	Conference or Workshop Item
Language:	English
Published:	2010
Subjects:	TA349 Mechanics of engineering. Applied mechanics
Online Access:	http://irep.iium.edu.my/39335/ http://irep.iium.edu.my/39335/1/EPTC_2010_Continuum_Damage_Evolution_in_Pb-Free_Solder_Joint_under_Shear_Fatigue_Loadings.pdf

id	iium-39335
recordtype	eprints
spelling	iium-393352014-12-03T00:25:20Z http://irep.iium.edu.my/39335/ Continuum damage evolution in pb-free solder joint under shear fatigue loadings Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Tamin, M.N. TA349 Mechanics of engineering. Applied mechanics Progressive materials damage process in solder joint under cyclic shear deformation is examined in this study. A 3-D finite element model of a single reflowed SAC405 solder specimen is developed for this purpose. Cyclic relative displacement cycles between zero and 1.0 mm at displacement ramp rate of 2.0 mm/sec. is applied in the direction parallel to the solder/pad interface. Strain rate-dependent response of the solder is modeled using unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solder. Damage initiation is characterized by the inelastic hysteresis energy per stabilized cycle, ΔW. Elastic stiffness of the solder is then degraded progressively using prescribed damage evolution rule. Results show that extensive inelastic strain accumulation is confined to small selected edge regions near the solder/pad interface. The calculated slow inelastic strain rates in the range of 0.24 to 0.29 sec-1 resulted in bulk solder fatigue failure. In the predominantly tensile stress region near the solder/pad interface, inelastic shear strain range parallel to and stress range normal to the interface plane has the greatest magnitude. The inelastic hysteresis energy or work per stabilized cycle has demonstrated to be a better parameter over accumulated inelastic strain per cycle for describing low cycle fatigue failure of solder joints. 2010 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/39335/1/EPTC_2010_Continuum_Damage_Evolution_in_Pb-Free_Solder_Joint_under_Shear_Fatigue_Loadings.pdf Shaffiar, Norhashimah and Loh, W.K. and Kamsah, N. and Tamin, M.N. (2010) Continuum damage evolution in pb-free solder joint under shear fatigue loadings. In: 12th Electronics Packaging Technology Conference, 8th - 10th December 2010 , Singapore .
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English
topic	TA349 Mechanics of engineering. Applied mechanics
spellingShingle	TA349 Mechanics of engineering. Applied mechanics Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Tamin, M.N. Continuum damage evolution in pb-free solder joint under shear fatigue loadings
description	Progressive materials damage process in solder joint under cyclic shear deformation is examined in this study. A 3-D finite element model of a single reflowed SAC405 solder specimen is developed for this purpose. Cyclic relative displacement cycles between zero and 1.0 mm at displacement ramp rate of 2.0 mm/sec. is applied in the direction parallel to the solder/pad interface. Strain rate-dependent response of the solder is modeled using unified inelastic strain equations (Anand’s model) with optimized model parameters for SAC405 solder. Damage initiation is characterized by the inelastic hysteresis energy per stabilized cycle, ΔW. Elastic stiffness of the solder is then degraded progressively using prescribed damage evolution rule. Results show that extensive inelastic strain accumulation is confined to small selected edge regions near the solder/pad interface. The calculated slow inelastic strain rates in the range of 0.24 to 0.29 sec-1 resulted in bulk solder fatigue failure. In the predominantly tensile stress region near the solder/pad interface, inelastic shear strain range parallel to and stress range normal to the interface plane has the greatest magnitude. The inelastic hysteresis energy or work per stabilized cycle has demonstrated to be a better parameter over accumulated inelastic strain per cycle for describing low cycle fatigue failure of solder joints.
format	Conference or Workshop Item
author	Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Tamin, M.N.
author_facet	Shaffiar, Norhashimah Loh, W.K. Kamsah, N. Tamin, M.N.
author_sort	Shaffiar, Norhashimah
title	Continuum damage evolution in pb-free solder joint under shear fatigue loadings
title_short	Continuum damage evolution in pb-free solder joint under shear fatigue loadings
title_full	Continuum damage evolution in pb-free solder joint under shear fatigue loadings
title_fullStr	Continuum damage evolution in pb-free solder joint under shear fatigue loadings
title_full_unstemmed	Continuum damage evolution in pb-free solder joint under shear fatigue loadings
title_sort	continuum damage evolution in pb-free solder joint under shear fatigue loadings
publishDate	2010
url	http://irep.iium.edu.my/39335/ http://irep.iium.edu.my/39335/1/EPTC_2010_Continuum_Damage_Evolution_in_Pb-Free_Solder_Joint_under_Shear_Fatigue_Loadings.pdf
first_indexed	2023-09-18T20:56:30Z
last_indexed	2023-09-18T20:56:30Z
_version_	1777410339729571840

Continuum damage evolution in pb-free solder joint under shear fatigue loadings

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