Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method

Instead of titanium dioxide (TiO2), many researches have been done to explore the compatibility of zinc oxide (ZnO) to be used as the active layer of memristor. In this study, an Au/ZnO-Cu2O-CuO/Cu memristor was fabricated using dilute electrodeposition and subsequently thermal oxidation. The XRD re...

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Main Authors: Fauzi, Fatin Bazilah, Othman, Raihan, Mohamed, Mohd Ambri, Herman, Sukreen Hana, Ahmad Azhar, Ahmad Zahirani, Ani, Mohd Hanafi
Format: Article
Language:English
Published: Japan Institute of Metals 2015
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Online Access:http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/1/Transition_metal_oxide_thin_film_memristor_on_cu_substrate_using_dilute_electrodeposition_method.pdf
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spelling iium-440342017-05-17T00:52:50Z http://irep.iium.edu.my/44034/ Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method Fauzi, Fatin Bazilah Othman, Raihan Mohamed, Mohd Ambri Herman, Sukreen Hana Ahmad Azhar, Ahmad Zahirani Ani, Mohd Hanafi TA401 Materials of engineering and construction Instead of titanium dioxide (TiO2), many researches have been done to explore the compatibility of zinc oxide (ZnO) to be used as the active layer of memristor. In this study, an Au/ZnO-Cu2O-CuO/Cu memristor was fabricated using dilute electrodeposition and subsequently thermal oxidation. The XRD result indicates that Zn was oxidized to ZnO and has a wurzite structure while copper (Cu) substrate was also oxidized to copper (I) oxide (Cu2O) and copper (II) oxide (CuO). The surface morphology of ZnO shows the formation of needle-like structure on the surface after the thermal oxidation process. 15 s deposited ZnO-Cu2O-CuO gave the thinnest film of 81 nm with largest value of resistance difference of 14.11 k3 and resistive switching ratio of 3.76. Empirical study on thermodynamics of metal oxides and diffusivity of Zn2+ and O21 in ZnO shows that the structure is formed due to the difference of diffusivity of each species during the thermal oxidation process. The synthesized Au/ZnO-Cu2O-CuO/Cu memristor shows a potential application in production of a non-complex and low cost memristor. Japan Institute of Metals 2015 Article PeerReviewed application/pdf en http://irep.iium.edu.my/44034/1/Transition_metal_oxide_thin_film_memristor_on_cu_substrate_using_dilute_electrodeposition_method.pdf Fauzi, Fatin Bazilah and Othman, Raihan and Mohamed, Mohd Ambri and Herman, Sukreen Hana and Ahmad Azhar, Ahmad Zahirani and Ani, Mohd Hanafi (2015) Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method. Materials Transactions, 56 (8). pp. 1302-1306. ISSN 1347-5320 (O), 1345-9678 (P) https://www.jim.or.jp/journal/e/ 10.2320/matertrans.M2015166
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
topic TA401 Materials of engineering and construction
spellingShingle TA401 Materials of engineering and construction
Fauzi, Fatin Bazilah
Othman, Raihan
Mohamed, Mohd Ambri
Herman, Sukreen Hana
Ahmad Azhar, Ahmad Zahirani
Ani, Mohd Hanafi
Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
description Instead of titanium dioxide (TiO2), many researches have been done to explore the compatibility of zinc oxide (ZnO) to be used as the active layer of memristor. In this study, an Au/ZnO-Cu2O-CuO/Cu memristor was fabricated using dilute electrodeposition and subsequently thermal oxidation. The XRD result indicates that Zn was oxidized to ZnO and has a wurzite structure while copper (Cu) substrate was also oxidized to copper (I) oxide (Cu2O) and copper (II) oxide (CuO). The surface morphology of ZnO shows the formation of needle-like structure on the surface after the thermal oxidation process. 15 s deposited ZnO-Cu2O-CuO gave the thinnest film of 81 nm with largest value of resistance difference of 14.11 k3 and resistive switching ratio of 3.76. Empirical study on thermodynamics of metal oxides and diffusivity of Zn2+ and O21 in ZnO shows that the structure is formed due to the difference of diffusivity of each species during the thermal oxidation process. The synthesized Au/ZnO-Cu2O-CuO/Cu memristor shows a potential application in production of a non-complex and low cost memristor.
format Article
author Fauzi, Fatin Bazilah
Othman, Raihan
Mohamed, Mohd Ambri
Herman, Sukreen Hana
Ahmad Azhar, Ahmad Zahirani
Ani, Mohd Hanafi
author_facet Fauzi, Fatin Bazilah
Othman, Raihan
Mohamed, Mohd Ambri
Herman, Sukreen Hana
Ahmad Azhar, Ahmad Zahirani
Ani, Mohd Hanafi
author_sort Fauzi, Fatin Bazilah
title Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
title_short Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
title_full Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
title_fullStr Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
title_full_unstemmed Transition metal oxide (TMO) thin film memristor on cu substrate using dilute electrodeposition method
title_sort transition metal oxide (tmo) thin film memristor on cu substrate using dilute electrodeposition method
publisher Japan Institute of Metals
publishDate 2015
url http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/
http://irep.iium.edu.my/44034/1/Transition_metal_oxide_thin_film_memristor_on_cu_substrate_using_dilute_electrodeposition_method.pdf
first_indexed 2023-09-18T21:02:38Z
last_indexed 2023-09-18T21:02:38Z
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