Mohamed Haider, F. I., ,, S., Ani, M. H., & Mahmood, M. H. (2017). Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology. Trans Tech Publications.
Chicago Style (17th ed.) CitationMohamed Haider, Farag I., Suryanto ,, Mohd Hanafi Ani, and Mahmood Hameed Mahmood. Evaluation of the Effects of Copper Electroplating Parameters on the Adhesion Using Response Surface Methodology. Trans Tech Publications, 2017.
MLA (8th ed.) CitationMohamed Haider, Farag I., et al. Evaluation of the Effects of Copper Electroplating Parameters on the Adhesion Using Response Surface Methodology. Trans Tech Publications, 2017.
Warning: These citations may not always be 100% accurate.