A framework to reduce redundancy in android test suite using refactoring

Micro gap heat sinks reduce flow boiling instabilities and generate more uniform surface temperature than typical microchannels. Heat transfer rate in micro gaps can be increased by providing micro fins. Micro fins increase surface area as well as generate turbulence, which disturbs the laminar sub...

Full description

Bibliographic Details
Main Authors: Omotunde, Habeeb, Ibrahim, Rosziati, Ahmed, Maryam, Olanrewaju, Rashidah Funke, Ibrahim, Noraini, Shah, H.
Format: Article
Language:English
English
Published: Indian Society for Education and Environment 2016
Subjects:
Online Access:http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/1/56209_A%20framework%20to%20reduce%20redundancy.pdf
http://irep.iium.edu.my/56209/2/56209_A%20framework%20to%20reduce%20redundancy_SCOPUS.pdf
id iium-56209
recordtype eprints
spelling iium-562092017-10-20T14:31:00Z http://irep.iium.edu.my/56209/ A framework to reduce redundancy in android test suite using refactoring Omotunde, Habeeb Ibrahim, Rosziati Ahmed, Maryam Olanrewaju, Rashidah Funke Ibrahim, Noraini Shah, H. TA Engineering (General). Civil engineering (General) TK Electrical engineering. Electronics Nuclear engineering Micro gap heat sinks reduce flow boiling instabilities and generate more uniform surface temperature than typical microchannels. Heat transfer rate in micro gaps can be increased by providing micro fins. Micro fins increase surface area as well as generate turbulence, which disturbs the laminar sub-layer. Hence, heat transfer rate enhances due to rapid fluid mixing. In this paper, effectiveness of flow boiling in a micro finned micro gap for cooling purpose has been investigated numerically. Flow boiling of pure water in the heat sink has been simulated using FLUENT 14.5 release. From results, it has been observed that upper and lower solid-fluid interfaces show different thermal behaviors with heat flux increment.Area-weighted average heat transfer coefficient of upper surface increases with increasing heat flux, while decreases for lower surface. In a net effect, thermal resistance of the heat sink increases with heat flux increment after onset of boiling for low Reynolds number. However, for high Reynolds number, thermal resistance changes slowly with heat flux variation. Pressure drop penalty has been found high for high heat fluxes during boiling. Interestingly, increment of pumping power is not always cost effective as thermal resistance does not decrease sharply all over the range. Hence, it is suggested that optimized pumping power should be used for highest efficiency. Indian Society for Education and Environment 2016-12 Article NonPeerReviewed application/pdf en http://irep.iium.edu.my/56209/1/56209_A%20framework%20to%20reduce%20redundancy.pdf application/pdf en http://irep.iium.edu.my/56209/2/56209_A%20framework%20to%20reduce%20redundancy_SCOPUS.pdf Omotunde, Habeeb and Ibrahim, Rosziati and Ahmed, Maryam and Olanrewaju, Rashidah Funke and Ibrahim, Noraini and Shah, H. (2016) A framework to reduce redundancy in android test suite using refactoring. Indian Journal of Science and Technology, 9 (46). pp. 107107-1. ISSN 0974-6846 E-ISSN 0974-5645 http://www.indjst.org/index.php/indjst/article/view/107107 10.17485/ijst/2016/v9i46/107107
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
English
topic TA Engineering (General). Civil engineering (General)
TK Electrical engineering. Electronics Nuclear engineering
spellingShingle TA Engineering (General). Civil engineering (General)
TK Electrical engineering. Electronics Nuclear engineering
Omotunde, Habeeb
Ibrahim, Rosziati
Ahmed, Maryam
Olanrewaju, Rashidah Funke
Ibrahim, Noraini
Shah, H.
A framework to reduce redundancy in android test suite using refactoring
description Micro gap heat sinks reduce flow boiling instabilities and generate more uniform surface temperature than typical microchannels. Heat transfer rate in micro gaps can be increased by providing micro fins. Micro fins increase surface area as well as generate turbulence, which disturbs the laminar sub-layer. Hence, heat transfer rate enhances due to rapid fluid mixing. In this paper, effectiveness of flow boiling in a micro finned micro gap for cooling purpose has been investigated numerically. Flow boiling of pure water in the heat sink has been simulated using FLUENT 14.5 release. From results, it has been observed that upper and lower solid-fluid interfaces show different thermal behaviors with heat flux increment.Area-weighted average heat transfer coefficient of upper surface increases with increasing heat flux, while decreases for lower surface. In a net effect, thermal resistance of the heat sink increases with heat flux increment after onset of boiling for low Reynolds number. However, for high Reynolds number, thermal resistance changes slowly with heat flux variation. Pressure drop penalty has been found high for high heat fluxes during boiling. Interestingly, increment of pumping power is not always cost effective as thermal resistance does not decrease sharply all over the range. Hence, it is suggested that optimized pumping power should be used for highest efficiency.
format Article
author Omotunde, Habeeb
Ibrahim, Rosziati
Ahmed, Maryam
Olanrewaju, Rashidah Funke
Ibrahim, Noraini
Shah, H.
author_facet Omotunde, Habeeb
Ibrahim, Rosziati
Ahmed, Maryam
Olanrewaju, Rashidah Funke
Ibrahim, Noraini
Shah, H.
author_sort Omotunde, Habeeb
title A framework to reduce redundancy in android test suite using refactoring
title_short A framework to reduce redundancy in android test suite using refactoring
title_full A framework to reduce redundancy in android test suite using refactoring
title_fullStr A framework to reduce redundancy in android test suite using refactoring
title_full_unstemmed A framework to reduce redundancy in android test suite using refactoring
title_sort framework to reduce redundancy in android test suite using refactoring
publisher Indian Society for Education and Environment
publishDate 2016
url http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/
http://irep.iium.edu.my/56209/1/56209_A%20framework%20to%20reduce%20redundancy.pdf
http://irep.iium.edu.my/56209/2/56209_A%20framework%20to%20reduce%20redundancy_SCOPUS.pdf
first_indexed 2023-09-18T21:19:18Z
last_indexed 2023-09-18T21:19:18Z
_version_ 1777411773947707392