APA (7th ed.) Citation

Tengku Azmi, T. M. A., & Sulaiman, N. (2017). Flip-chip bonding fabrication technique. IOP Publishing.

Chicago Style (17th ed.) Citation

Tengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Flip-chip Bonding Fabrication Technique. IOP Publishing, 2017.

MLA (8th ed.) Citation

Tengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Flip-chip Bonding Fabrication Technique. IOP Publishing, 2017.

Warning: These citations may not always be 100% accurate.