Tengku Azmi, T. M. A., & Sulaiman, N. (2017). Simulation and fabrication of micro magnetometer using flip-chip bonding technique.
Chicago Style (17th ed.) CitationTengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Simulation and Fabrication of Micro Magnetometer Using Flip-chip Bonding Technique. 2017.
MLA (8th ed.) CitationTengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Simulation and Fabrication of Micro Magnetometer Using Flip-chip Bonding Technique. 2017.
Warning: These citations may not always be 100% accurate.