Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)

. Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The prob...

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Main Authors:	Roslan, Muhamad Fahmi Mohd, Shaffiar, Norhashimah, Muhamad Khairussaleh, Nor Khairusshima, Syed Shaharuddin, Sharifah Imihezri
Format:	Conference or Workshop Item
Language:	English English English
Published:	Institute of Physics Publishing 2018
Subjects:	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
Online Access:	http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf

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spelling	iium-645492019-01-24T00:52:20Z http://irep.iium.edu.my/64549/ Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS) Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery . Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The problem occurs when deformation applied to the stretchable electronic circuit, it cannot maintain its functionality. Fracture may happen on the conductor. In this research, the study on deformation of stretchable electronic interconnects substrate using Polydimethlysiloxanes is carried out. The purpose of this research are to study the axial deformation occur, to determine the optimum shape of the conductor designs (horseshoe, rectangular and u-shape design) for the stretchable electronic interconnect and to compare the mechanical properties of Polydimethlysiloxanes (PDMS) with Polyurethane (PU) using Finite Element Analysis (FEA). The simulation was done on the FE model of the stretchable circuit with dimension of 2.4 X 2.4 X 0.5 mm. The stretching of the FE model was simulated with the range of elongation at 10, 20 and 30 percent from its original length in order to find the strain value for all three of the conductor designs. The best conductor design is used to simulate with different types of substrate (PDMS and PU). From the simulation result, Horseshoe design record the lowest strain value for each elongation, followed by rectangular and U-shape design. Thus, Horseshoe is considered as the optimum design for the conductor compared to the other two designs. From the result also, it shows that PDMS substrate will offer more maximum allowable stretchability compared to PU substrates. Thus PDMS is considered as a better substrate compare to PU. PDMS is a good material to replace PU since it can perform under tension much better mechanically. Institute of Physics Publishing 2018-01-30 Conference or Workshop Item PeerReviewed application/pdf en http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf application/pdf en http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf application/pdf en http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf Roslan, Muhamad Fahmi Mohd and Shaffiar, Norhashimah and Muhamad Khairussaleh, Nor Khairusshima and Syed Shaharuddin, Sharifah Imihezri (2018) Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS). In: International Conference on Advances in Manufacturing and Materials Engineering 2017, ICAMME 2017, 8 - 9 August 2017, Gombak, Kuala Lumpur. http://iopscience.iop.org/article/10.1088/1757-899X/290/1/012022/pdf 10.1088/1757-899X/290/1/012022
repository_type	Digital Repository
institution_category	Local University
institution	International Islamic University Malaysia
building	IIUM Repository
collection	Online Access
language	English English English
topic	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
spellingShingle	T Technology (General) TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
description	. Over the years, the technology of electronic industry has growth tremendously. Open ended research on how to make a better concept of electronic circuit is ongoing especially on the stretchable electronic devices. There are many designs to achieve stretchability in electronic circuits. The problem occurs when deformation applied to the stretchable electronic circuit, it cannot maintain its functionality. Fracture may happen on the conductor. In this research, the study on deformation of stretchable electronic interconnects substrate using Polydimethlysiloxanes is carried out. The purpose of this research are to study the axial deformation occur, to determine the optimum shape of the conductor designs (horseshoe, rectangular and u-shape design) for the stretchable electronic interconnect and to compare the mechanical properties of Polydimethlysiloxanes (PDMS) with Polyurethane (PU) using Finite Element Analysis (FEA). The simulation was done on the FE model of the stretchable circuit with dimension of 2.4 X 2.4 X 0.5 mm. The stretching of the FE model was simulated with the range of elongation at 10, 20 and 30 percent from its original length in order to find the strain value for all three of the conductor designs. The best conductor design is used to simulate with different types of substrate (PDMS and PU). From the simulation result, Horseshoe design record the lowest strain value for each elongation, followed by rectangular and U-shape design. Thus, Horseshoe is considered as the optimum design for the conductor compared to the other two designs. From the result also, it shows that PDMS substrate will offer more maximum allowable stretchability compared to PU substrates. Thus PDMS is considered as a better substrate compare to PU. PDMS is a good material to replace PU since it can perform under tension much better mechanically.
format	Conference or Workshop Item
author	Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri
author_facet	Roslan, Muhamad Fahmi Mohd Shaffiar, Norhashimah Muhamad Khairussaleh, Nor Khairusshima Syed Shaharuddin, Sharifah Imihezri
author_sort	Roslan, Muhamad Fahmi Mohd
title	Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
title_short	Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
title_full	Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
title_fullStr	Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
title_full_unstemmed	Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)
title_sort	finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (pdms)
publisher	Institute of Physics Publishing
publishDate	2018
url	http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/ http://irep.iium.edu.my/64549/1/64549_Finite%20element%20analysis%20on%20deformation_conference%20article.pdf http://irep.iium.edu.my/64549/2/64549_Finite%20element%20analysis%20on%20deformation_scopus.pdf http://irep.iium.edu.my/64549/13/64549_Finite%20element%20analysis%20on%20deformation_WoS.pdf
first_indexed	2023-09-18T21:31:37Z
last_indexed	2023-09-18T21:31:37Z
_version_	1777412548737368064

Finite element analysis on deformation of stretchable electronic interconnect substrate using polydimethylsiloxanes (PDMS)

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