APA (7th ed.) Citation

Tengku Azmi, T. M. A., & Sulaiman, N. (2019). Simulation and fabrication of micro magnetometer using flip-chip bonding technique. Springer Verlag.

Chicago Style (17th ed.) Citation

Tengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Simulation and Fabrication of Micro Magnetometer Using Flip-chip Bonding Technique. Springer Verlag, 2019.

MLA (8th ed.) Citation

Tengku Azmi, Tengku Muhammad Afif, and Nadzril Sulaiman. Simulation and Fabrication of Micro Magnetometer Using Flip-chip Bonding Technique. Springer Verlag, 2019.