Tengku Azmi, T. M. A., Sulaiman, N., & Alfred, R. (2019). Simulation and fabrication of micro magnetometer using flip-chip bonding technique. Springer Nature Singapore Pte Ltd.
Chicago Style (17th ed.) CitationTengku Azmi, Tengku Muhammad Afif, Nadzril Sulaiman, and Rayner Alfred. Simulation and Fabrication of Micro Magnetometer using Flip-chip Bonding Technique. Springer Nature Singapore Pte Ltd, 2019.
MLA (8th ed.) CitationTengku Azmi, Tengku Muhammad Afif, et al. Simulation and Fabrication of Micro Magnetometer using Flip-chip Bonding Technique. Springer Nature Singapore Pte Ltd, 2019.
Warning: These citations may not always be 100% accurate.