Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad

Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6 Sn5 and Cu Sn. The growth of Cu6 Sn5 and Cu Sn intermetallics have been invest...

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Main Authors:	Mayappan, Ramani, Ahmad, Zainal Arifin
Format:	Article
Language:	English
Published:	Research Management Institute (RMI) 2010
Subjects:	Intermetallic compounds Solder and soldering
Online Access:	http://ir.uitm.edu.my/id/eprint/12940/ http://ir.uitm.edu.my/id/eprint/12940/1/AJ_RAMANI%20MAYAPPAN%20SRJ%2010%201.pdf

id	uitm-12940
recordtype	eprints
spelling	uitm-129402016-05-30T02:14:15Z http://ir.uitm.edu.my/id/eprint/12940/ Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad Mayappan, Ramani Ahmad, Zainal Arifin Intermetallic compounds Solder and soldering Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6 Sn5 and Cu Sn. The growth of Cu6 Sn5 and Cu Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solderjoints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6 Sn5 phase, however after aging a Cu Sn layer below the Cu6 Sn5 is observed to manifest. The Cu6 Sn5 layer develops with a scalloped morphology, whereas the Cu Sn layer always develops an undulating planar shape in phase with the Cu6 Sn5. The C1I6Sn5 layer begins to transform from a scalloped- to a planar-shape as aging progresses in order to minimize the interfacial energy. The intermetallic layers exhibit a linear dependence on the square root ofaging time, which corresponds to diffusion-controlled growth. The activation energy for the growth of the CuSn, intermetallic layer has been determined to be 56.16 kJlmol. Research Management Institute (RMI) 2010 Article PeerReviewed text en http://ir.uitm.edu.my/id/eprint/12940/1/AJ_RAMANI%20MAYAPPAN%20SRJ%2010%201.pdf Mayappan, Ramani and Ahmad, Zainal Arifin (2010) Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad. Scientific Research Journal, 7 (2). pp. 1-17. ISSN 1675-7009
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Teknologi MARA
building	UiTM Institutional Repository
collection	Online Access
language	English
topic	Intermetallic compounds Solder and soldering
spellingShingle	Intermetallic compounds Solder and soldering Mayappan, Ramani Ahmad, Zainal Arifin Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
description	Replacing Sn-Pb solder with lead-free solder is a great challenge in the electronics industry. The presented lead-free solder is Sn based and forms two intermetallic species upon reaction with the Cu substrate, namely Cu6 Sn5 and Cu Sn. The growth of Cu6 Sn5 and Cu Sn intermetallics have been investigated with respect to Sn-40Pb/Cu solderjoints. The joints were aged under long-term thermal exposure using single shear lap joints and the intermetallics were observed using scanning electron microscopy. As-soldered solder joints exhibit a single Cu6 Sn5 phase, however after aging a Cu Sn layer below the Cu6 Sn5 is observed to manifest. The Cu6 Sn5 layer develops with a scalloped morphology, whereas the Cu Sn layer always develops an undulating planar shape in phase with the Cu6 Sn5. The C1I6Sn5 layer begins to transform from a scalloped- to a planar-shape as aging progresses in order to minimize the interfacial energy. The intermetallic layers exhibit a linear dependence on the square root ofaging time, which corresponds to diffusion-controlled growth. The activation energy for the growth of the CuSn, intermetallic layer has been determined to be 56.16 kJlmol.
format	Article
author	Mayappan, Ramani Ahmad, Zainal Arifin
author_facet	Mayappan, Ramani Ahmad, Zainal Arifin
author_sort	Mayappan, Ramani
title	Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
title_short	Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
title_full	Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
title_fullStr	Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
title_full_unstemmed	Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad
title_sort	cu6 sn5 and cu3 sn intermetallics study in the sn-40pb/cu system during long-term aging / ramani mayappan and zainal arifin ahmad
publisher	Research Management Institute (RMI)
publishDate	2010
url	http://ir.uitm.edu.my/id/eprint/12940/ http://ir.uitm.edu.my/id/eprint/12940/1/AJ_RAMANI%20MAYAPPAN%20SRJ%2010%201.pdf
first_indexed	2023-09-18T22:49:35Z
last_indexed	2023-09-18T22:49:35Z
_version_	1777417454580924416

Cu6 Sn5 and Cu3 Sn intermetallics study in the Sn-40Pb/Cu system during long-term aging / Ramani Mayappan and Zainal Arifin Ahmad

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