ICP-RIE dry etching using Cl2-based on GaN

In this study, the plasma characteristics and GaN etch properties of inductively coupled Cl2/Ar and Cl2/H2 plasmas were investigated. Our results showed that inductively coupled plasma (ICP) etching of gallium nitride by using Cl2/Ar and Cl2/H2 were possible to meet the requirements (anisotropy, h...

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Main Authors: Siti Azlina Rosli, Azlan Abdul Aziz, Md Roslan Hashim
Format: Article
Language:English
Published: Universiti Kebangsaan Malaysia 2011
Online Access:http://journalarticle.ukm.my/2454/
http://journalarticle.ukm.my/2454/
http://journalarticle.ukm.my/2454/1/18_Siti_Azlina.pdf
id ukm-2454
recordtype eprints
spelling ukm-24542016-12-14T06:31:40Z http://journalarticle.ukm.my/2454/ ICP-RIE dry etching using Cl2-based on GaN Siti Azlina Rosli, Azlan Abdul Aziz, Md Roslan Hashim, In this study, the plasma characteristics and GaN etch properties of inductively coupled Cl2/Ar and Cl2/H2 plasmas were investigated. Our results showed that inductively coupled plasma (ICP) etching of gallium nitride by using Cl2/Ar and Cl2/H2 were possible to meet the requirements (anisotropy, high etch rate and high selectivity). We have investigated the etching rate dependency on the percentage of argon and hydrogen in the gas mixture and the DC voltage. Surface morphology of the etched samples was checked by SEM and AFM. It was found that the etched surface was anisotropic and the smoothness of the etched surface is comparable to that of polished wafer. As results, gas mixture using Cl2/Ar, we obtained highest etching rates; 5000 Å/min and ~0.5 nm rms roughness for n-GaN and for p-GaN, the etching rates was 3300 Å/min and ~0.7 nm for rms roughness. Meanwhile, for gas mixture using Cl2/H2, the etching was 1580 Å/min for n-GaN and 950 Å/min for p-GaN. Universiti Kebangsaan Malaysia 2011-01 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/2454/1/18_Siti_Azlina.pdf Siti Azlina Rosli, and Azlan Abdul Aziz, and Md Roslan Hashim, (2011) ICP-RIE dry etching using Cl2-based on GaN. Sains Malaysiana, 40 (1). pp. 79-82. ISSN 0126-6039 http://www.ukm.my/jsm/
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institution Universiti Kebangasaan Malaysia
building UKM Institutional Repository
collection Online Access
language English
description In this study, the plasma characteristics and GaN etch properties of inductively coupled Cl2/Ar and Cl2/H2 plasmas were investigated. Our results showed that inductively coupled plasma (ICP) etching of gallium nitride by using Cl2/Ar and Cl2/H2 were possible to meet the requirements (anisotropy, high etch rate and high selectivity). We have investigated the etching rate dependency on the percentage of argon and hydrogen in the gas mixture and the DC voltage. Surface morphology of the etched samples was checked by SEM and AFM. It was found that the etched surface was anisotropic and the smoothness of the etched surface is comparable to that of polished wafer. As results, gas mixture using Cl2/Ar, we obtained highest etching rates; 5000 Å/min and ~0.5 nm rms roughness for n-GaN and for p-GaN, the etching rates was 3300 Å/min and ~0.7 nm for rms roughness. Meanwhile, for gas mixture using Cl2/H2, the etching was 1580 Å/min for n-GaN and 950 Å/min for p-GaN.
format Article
author Siti Azlina Rosli,
Azlan Abdul Aziz,
Md Roslan Hashim,
spellingShingle Siti Azlina Rosli,
Azlan Abdul Aziz,
Md Roslan Hashim,
ICP-RIE dry etching using Cl2-based on GaN
author_facet Siti Azlina Rosli,
Azlan Abdul Aziz,
Md Roslan Hashim,
author_sort Siti Azlina Rosli,
title ICP-RIE dry etching using Cl2-based on GaN
title_short ICP-RIE dry etching using Cl2-based on GaN
title_full ICP-RIE dry etching using Cl2-based on GaN
title_fullStr ICP-RIE dry etching using Cl2-based on GaN
title_full_unstemmed ICP-RIE dry etching using Cl2-based on GaN
title_sort icp-rie dry etching using cl2-based on gan
publisher Universiti Kebangsaan Malaysia
publishDate 2011
url http://journalarticle.ukm.my/2454/
http://journalarticle.ukm.my/2454/
http://journalarticle.ukm.my/2454/1/18_Siti_Azlina.pdf
first_indexed 2023-09-18T19:36:06Z
last_indexed 2023-09-18T19:36:06Z
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