Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

Numerical modelling of cyclic stress-strain behaviour of sn pb solder joint during thermal fatigue

Bibliographic Details
Main Authors:	Mohd Nasir Tamin, Liew, Yek Ban
Format:	Article
Language:	English
Published:	Penerbit UKM 2008
Online Access:	http://journalarticle.ukm.my/2566/ http://journalarticle.ukm.my/2566/ http://journalarticle.ukm.my/2566/1/2008-9.pdf

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