Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperat...

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Main Authors:	Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad
Format:	Article
Language:	English
Published:	Universiti Kebangsaan Malaysia 2014
Online Access:	http://journalarticle.ukm.my/6823/ http://journalarticle.ukm.my/6823/ http://journalarticle.ukm.my/6823/1/15_Nor_Adhila.pdf

id	ukm-6823
recordtype	eprints
spelling	ukm-68232016-12-14T06:42:18Z http://journalarticle.ukm.my/6823/ Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad, A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperature differences where non-uniform heating or cooling may result in material failure due to increase in thermal stresses or serious damage. From this study, it was found that at a peak temperature (Tpeak) of 251°C, the reflowed solder was observed to be smooth joint appearance over the solder pad and formed a regular joint shape of the solder due to the efficient reflow profile and sufficient heating input during the reflow process. The Ni3Sn4 intermetallic compounds were found to be continuous, thus resulting in a good metallurgical bonding between Sn3.5Ag solder and ENIG substrate. Meanwhile, an uneven reflowed solder and defect mechanism was detected at Tpeak of 246 and 260°C. This is due to the inadequate reflow profile and insufficient heating input during the reflow soldering process in the RTP system. Visual micrographs of reflowed solder and cross-sectional micrograph and elemental analysis were presented in this paper for better understanding of the defect mechanism in order to optimize the reflow soldering process using RTP system. The reflow soldering process can be performed better with appropriate reflow profile in the RTP system in order to achieve a good solder joint of Sn3.5Ag solder and ENIG substrate. Universiti Kebangsaan Malaysia 2014-01 Article PeerReviewed application/pdf en http://journalarticle.ukm.my/6823/1/15_Nor_Adhila.pdf Nor Adhila Muhammad, and Badariah Bais, and Ibrahim Ahmad, (2014) Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system. Sains Malaysiana, 43 (1). pp. 117-122. ISSN 0126-6039 http://www.ukm.my/jsm/
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Kebangasaan Malaysia
building	UKM Institutional Repository
collection	Online Access
language	English
description	A study on reflow soldering process for Sn3.5Ag solder on ENIG substrate was performed using the rapid thermal processing (RTP) system. The reflow soldering process by RTP system can be successful, but it is sensitive to some typical defects. A poor RTP system design can lead to significant temperature differences where non-uniform heating or cooling may result in material failure due to increase in thermal stresses or serious damage. From this study, it was found that at a peak temperature (Tpeak) of 251°C, the reflowed solder was observed to be smooth joint appearance over the solder pad and formed a regular joint shape of the solder due to the efficient reflow profile and sufficient heating input during the reflow process. The Ni3Sn4 intermetallic compounds were found to be continuous, thus resulting in a good metallurgical bonding between Sn3.5Ag solder and ENIG substrate. Meanwhile, an uneven reflowed solder and defect mechanism was detected at Tpeak of 246 and 260°C. This is due to the inadequate reflow profile and insufficient heating input during the reflow soldering process in the RTP system. Visual micrographs of reflowed solder and cross-sectional micrograph and elemental analysis were presented in this paper for better understanding of the defect mechanism in order to optimize the reflow soldering process using RTP system. The reflow soldering process can be performed better with appropriate reflow profile in the RTP system in order to achieve a good solder joint of Sn3.5Ag solder and ENIG substrate.
format	Article
author	Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad,
spellingShingle	Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad, Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
author_facet	Nor Adhila Muhammad, Badariah Bais, Ibrahim Ahmad,
author_sort	Nor Adhila Muhammad,
title	Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_short	Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_full	Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_fullStr	Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_full_unstemmed	Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system
title_sort	reflow soldering process for sn3.5ag solder on enig using rapid thermal processing system
publisher	Universiti Kebangsaan Malaysia
publishDate	2014
url	http://journalarticle.ukm.my/6823/ http://journalarticle.ukm.my/6823/ http://journalarticle.ukm.my/6823/1/15_Nor_Adhila.pdf
first_indexed	2023-09-18T19:47:59Z
last_indexed	2023-09-18T19:47:59Z
_version_	1777406028987498496

Reflow soldering process for Sn3.5Ag solder on ENIG using rapid thermal processing system

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