Effect of Immersion Coating Deposition Time on Solder Joint Properties

Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion...

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Main Authors:	Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Article
Language:	English
Published:	Trans Tech Publications, Switzerland 2016
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf

id	ump-11693
recordtype	eprints
spelling	ump-116932018-01-15T08:27:55Z http://umpir.ump.edu.my/id/eprint/11693/ Effect of Immersion Coating Deposition Time on Solder Joint Properties Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively. Trans Tech Publications, Switzerland 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar and Siti Rabiatull Aisha, Idris and M., Ishak (2016) Effect of Immersion Coating Deposition Time on Solder Joint Properties. Advanced Materials Research, 1133. pp. 361-365. ISSN 1022-6680 (print), 1662-8985 (online) http://www.scientific.net/AMR.1133.361 DOI: 10.4028/www.scientific.net/AMR.1133.361
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak Effect of Immersion Coating Deposition Time on Solder Joint Properties
description	Surface finishes on copper pads have been known to be one of influential factor in the solder joint quality. This due to the difference in interfacial reaction and intermetallic compound formation on solder pad was strongly influence by the type of surface finishes. Deposition times during immersion plating process on copper pads are important as the thickness of coating will decide several properties of surface finish, such as wettability during soldering process. Thus, this study aims to investigate the effect of deposition time of immersion gold coating on wettability of the surface finish and how it affect the formation of intermetallic compounds on solder joint. In this works, deposition time of copper pads in immersion gold solution were varied from 3 minutes up to 15 minutes. The thickness of immersion gold layer that form on Cu pads were then measured using Scanning Electron Microscopy (SEM). As the main objective of this study is to study the effect of deposition time during immersion plating process towards solder joint, the pads were reflowed along with Sn-3.0Ag-0.5Cu solder in furnace under temperature 250 °C for 25 minutes. Then, the cross sections of the solder joints were examined using optical microscope in order to measure the wetting angle and thickness of intermetallic compound formed; which acceptable value in industrial area, should be below 40 ̊ and below 4μm as reflow respectively.
format	Article
author	Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak
author_facet	Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak
author_sort	Zetty Akhtar, Abd Malek
title	Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_short	Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_full	Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_fullStr	Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_full_unstemmed	Effect of Immersion Coating Deposition Time on Solder Joint Properties
title_sort	effect of immersion coating deposition time on solder joint properties
publisher	Trans Tech Publications, Switzerland
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/ http://umpir.ump.edu.my/id/eprint/11693/1/Effect%20of%20Immersion%20Coating%20Deposition%20Time%20on%20Solder%20Joint%20Properties.pdf
first_indexed	2023-09-18T22:12:38Z
last_indexed	2023-09-18T22:12:38Z
_version_	1777415128973574144

Effect of Immersion Coating Deposition Time on Solder Joint Properties

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