APA (7th ed.) Citation

Siti Rabiatull Aisha, I., Ourdjini, A., Azmah Hanim, M. A., & Saliza Azlina, O. (2015). Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. Wessex Institute of Technology.

Chicago Style (17th ed.) Citation

Siti Rabiatull Aisha, Idris, Ali Ourdjini, Mohamad Ariff Azmah Hanim, and Osman Saliza Azlina. Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. Wessex Institute of Technology, 2015.

MLA (8th ed.) Citation

Siti Rabiatull Aisha, Idris, et al. Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method. Wessex Institute of Technology, 2015.