Intermetallic Growth and Shear Strength of SAC305/EN-Boron

The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by ref...

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Main Authors:	Hardinnawirda, Kahar, Zetty Akhtar, Abd Malek, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Article
Language:	English English
Published:	Emerald Group Publishing Limited 2016
Subjects:	Not Available
Online Access:	http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf

id	ump-13899
recordtype	eprints
spelling	ump-138992018-01-15T06:52:45Z http://umpir.ump.edu.my/id/eprint/13899/ Intermetallic Growth and Shear Strength of SAC305/EN-Boron Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak Not Available The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by reflow soldering of a Sn-3.0Ag-0.5Cu solder alloy on metallized Cu substrate to form a joining. Then, the specimens were cooled using different cooling medium which were air (slow cooling) with 15.7°C/min and water (fast cooling) with 110.5°C/min. After that, the specimens were subjected to isothermal aging at 150°C for 0, 250, and 1000 hours. Finally, they went through a lap shear test following a standard of ASTM D1002. Optical microscope and SEM were used for IMC characterization. The type of IMC formed was confirmed by FESEM-EDX. The results showed that the IMC type changed from the combination of Ni3Sn4 and (Ni, Cu)3Sn4 after reflow soldering into fully (Ni,Cu)3Sn4 when aged for 1000 hours. The formation of (Ni,Cu)3Sn4 and Cu3Sn underneath the IMC layer played a role in reducing the shear strength of joining. Overall, water cooling was reported to provide higher shear strength of solder joint compared to air cooling medium. The shear strength between solder alloy and EN-Boron surface finish is comparable to the surface finish conventionally used. Emerald Group Publishing Limited 2016 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf Hardinnawirda, Kahar and Zetty Akhtar, Abd Malek and Siti Rabiatull Aisha, Idris and M., Ishak (2016) Intermetallic Growth and Shear Strength of SAC305/EN-Boron. Soldering & Surface Mount Technology, 28 (3). pp. 141-148. ISSN 0954-0911 http://dx.doi.org/10.1108/SSMT-05-2015-0019 DOI: 10.1108/SSMT-05-2015-0019
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English
topic	Not Available
spellingShingle	Not Available Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak Intermetallic Growth and Shear Strength of SAC305/EN-Boron
description	The paper aimed to study the effect of aging and cooling rate on the reliability of the solder joint using electroless nickel boron (EN-Boron) as a surface finish in the electronic packaging area.EN-Boron was plated on Cu substrate through electroless plating method. This process was followed by reflow soldering of a Sn-3.0Ag-0.5Cu solder alloy on metallized Cu substrate to form a joining. Then, the specimens were cooled using different cooling medium which were air (slow cooling) with 15.7°C/min and water (fast cooling) with 110.5°C/min. After that, the specimens were subjected to isothermal aging at 150°C for 0, 250, and 1000 hours. Finally, they went through a lap shear test following a standard of ASTM D1002. Optical microscope and SEM were used for IMC characterization. The type of IMC formed was confirmed by FESEM-EDX. The results showed that the IMC type changed from the combination of Ni3Sn4 and (Ni, Cu)3Sn4 after reflow soldering into fully (Ni,Cu)3Sn4 when aged for 1000 hours. The formation of (Ni,Cu)3Sn4 and Cu3Sn underneath the IMC layer played a role in reducing the shear strength of joining. Overall, water cooling was reported to provide higher shear strength of solder joint compared to air cooling medium. The shear strength between solder alloy and EN-Boron surface finish is comparable to the surface finish conventionally used.
format	Article
author	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_facet	Hardinnawirda, Kahar Zetty Akhtar, Abd Malek Siti Rabiatull Aisha, Idris M., Ishak
author_sort	Hardinnawirda, Kahar
title	Intermetallic Growth and Shear Strength of SAC305/EN-Boron
title_short	Intermetallic Growth and Shear Strength of SAC305/EN-Boron
title_full	Intermetallic Growth and Shear Strength of SAC305/EN-Boron
title_fullStr	Intermetallic Growth and Shear Strength of SAC305/EN-Boron
title_full_unstemmed	Intermetallic Growth and Shear Strength of SAC305/EN-Boron
title_sort	intermetallic growth and shear strength of sac305/en-boron
publisher	Emerald Group Publishing Limited
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/ http://umpir.ump.edu.my/id/eprint/13899/1/Intermetallic%20growth%20and%20shear%20strength%20of%20%20SAC305EN-Boron_wirda.pdf http://umpir.ump.edu.my/id/eprint/13899/7/fkm-2016-aisha-Intermetallic%20growth%20and%20shear%20strength1.pdf
first_indexed	2023-09-18T22:17:01Z
last_indexed	2023-09-18T22:17:01Z
_version_	1777415405691731968

Intermetallic Growth and Shear Strength of SAC305/EN-Boron

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