Experimental laser-machining of silicon wafer

This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis d...

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Main Author:	Lau, Zhen Chyen
Format:	Undergraduates Project Papers
Language:	English
Published:	2010
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/1/Lau%2C_Zhen_Chyen_%28_CD_5022_%29.pdf

id	ump-1417
recordtype	eprints
spelling	ump-14172015-03-03T07:50:52Z http://umpir.ump.edu.my/id/eprint/1417/ Experimental laser-machining of silicon wafer Lau, Zhen Chyen TJ Mechanical engineering and machinery This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis describes how machining parameters and air assist gas affects cut surface quality. The silicon wafer was machined by laser with and without air assists. Principally, two experimental sets with different cutting speed and laser power were designed in statistical software. The kerf widths and quality were observed under microscopes. The results then were analyzed using statistica software. The analysis indicated that cutting speed has significant effect to the kerf width and laser cutting with air assists produced wider kerf. Result obtained also showed that laser cutting without air assists produced better cut surface quality. The feasible machining parameter of silicon is estimated at 1.0-2.0 mm/min for cutting velocity, 0.80-0.94 watt for laser power in laser cutting without air assist and 1.0-4.0 mm/min for cutting velocity, 0.80-0.90 watt for laser power in laser cutting with air assist. 2010-12 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/1417/1/Lau%2C_Zhen_Chyen_%28_CD_5022_%29.pdf Lau, Zhen Chyen (2010) Experimental laser-machining of silicon wafer. Faculty of Mechanical Engineering, Universiti Malaysia Pahang. http://iportal.ump.edu.my/lib/item?id=chamo:52538&theme=UMP2
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Lau, Zhen Chyen Experimental laser-machining of silicon wafer
description	This thesis deals with laser machining of silicon wafer at various process parameters. The objective of this thesis is to investigate the effect of laser machining parameters on the cut surface quality and determine the feasible laser machining parameters that can machine silicon wafer. The thesis describes how machining parameters and air assist gas affects cut surface quality. The silicon wafer was machined by laser with and without air assists. Principally, two experimental sets with different cutting speed and laser power were designed in statistical software. The kerf widths and quality were observed under microscopes. The results then were analyzed using statistica software. The analysis indicated that cutting speed has significant effect to the kerf width and laser cutting with air assists produced wider kerf. Result obtained also showed that laser cutting without air assists produced better cut surface quality. The feasible machining parameter of silicon is estimated at 1.0-2.0 mm/min for cutting velocity, 0.80-0.94 watt for laser power in laser cutting without air assist and 1.0-4.0 mm/min for cutting velocity, 0.80-0.90 watt for laser power in laser cutting with air assist.
format	Undergraduates Project Papers
author	Lau, Zhen Chyen
author_facet	Lau, Zhen Chyen
author_sort	Lau, Zhen Chyen
title	Experimental laser-machining of silicon wafer
title_short	Experimental laser-machining of silicon wafer
title_full	Experimental laser-machining of silicon wafer
title_fullStr	Experimental laser-machining of silicon wafer
title_full_unstemmed	Experimental laser-machining of silicon wafer
title_sort	experimental laser-machining of silicon wafer
publishDate	2010
url	http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/ http://umpir.ump.edu.my/id/eprint/1417/1/Lau%2C_Zhen_Chyen_%28_CD_5022_%29.pdf
first_indexed	2023-09-18T21:54:32Z
last_indexed	2023-09-18T21:54:32Z
_version_	1777413990901612544

Experimental laser-machining of silicon wafer

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