Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes

In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of m...

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Main Authors: Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ali, Ourdjini, Saliza Azlina, Osman
Format: Article
Language:English
Published: Faculty Mechanical Engineering, UMP 2015
Subjects:
Q Science (General)
Online Access:http://umpir.ump.edu.my/id/eprint/16200/
http://umpir.ump.edu.my/id/eprint/16200/
http://umpir.ump.edu.my/id/eprint/16200/1/IJCAT%2052%284%29%20Paper%206_2015_kak%20azmah.pdf
id ump-16200
recordtype eprints
spelling ump-162002018-01-15T07:47:12Z http://umpir.ump.edu.my/id/eprint/16200/ Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes Siti Rabiatull Aisha, Idris Azmah Hanim, Mohamad Ariff Ali, Ourdjini Saliza Azlina, Osman Q Science (General) In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focuses on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Sandwich samples were prepared by placing solder balls of Sn-4Ag-0.5Cu between two substrates of two different surface finishes: Ni/Au and Ni/Pd/Au. Optical microscope and FESEM (Field emission scanning electron microscope) were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni)6Sn5 to (Ni, Cu)3Sn4 after 1000 thermal cycles for Ni/Au. These changes promote the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. This shows that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment. Based on these results, it can be concluded that the reliability of the Ni/Pd/Au surface finishes with Sn-4Ag-0.5Cu solders is higher within the given condition of this research. Faculty Mechanical Engineering, UMP 2015 Article PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/16200/1/IJCAT%2052%284%29%20Paper%206_2015_kak%20azmah.pdf Siti Rabiatull Aisha, Idris and Azmah Hanim, Mohamad Ariff and Ali, Ourdjini and Saliza Azlina, Osman (2015) Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes. Journal of Mechanical Engineering and Sciences (JMES) , 9. pp. 1572-1579. ISSN 2289-4659 (print); 2231-8380 (online) http://dx.doi.org/10.15282/jmes.9.2015.4.0152
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
topic Q Science (General)
spellingShingle Q Science (General)
Siti Rabiatull Aisha, Idris
Azmah Hanim, Mohamad Ariff
Ali, Ourdjini
Saliza Azlina, Osman
Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
description In electronic packaging, the reliability of the interconnection changes with the surface finish and the type of solders being used. Thermal cycling is one method of reliability assessment. In thermal cycling experiments, the strain state is simplified by soldering together regular shaped pieces of materials with different coefficients of thermal expansion and exposing the joint to repeated fluctuations of temperature within a certain range. Thus, this study focuses on the intermetallic evolution of Sn-4Ag-0.5Cu on Ni/Au and Ni/Pd/Au surface finishes with thermal cycling up to 1000 cycles with the range of temperature varying from 10 to 80 °C. Sandwich samples were prepared by placing solder balls of Sn-4Ag-0.5Cu between two substrates of two different surface finishes: Ni/Au and Ni/Pd/Au. Optical microscope and FESEM (Field emission scanning electron microscope) were used to analyze the samples. From the study, it was observed that the intermetallic changes from (Cu, Ni)6Sn5 to (Ni, Cu)3Sn4 after 1000 thermal cycles for Ni/Au. These changes promote the formation of cracks at the solder joint because of the different mechanical properties between Ni-Sn based intermetallic and Cu-Sn intermetallics. However, for the Ni/Pd/Au surface finishes, no cracks formed after thermal cycling up to 1000 cycles. This shows that the reliability of the solder joint is higher for Ni/Pd/Au surface finishes in this experiment. Based on these results, it can be concluded that the reliability of the Ni/Pd/Au surface finishes with Sn-4Ag-0.5Cu solders is higher within the given condition of this research.
format Article
author Siti Rabiatull Aisha, Idris
Azmah Hanim, Mohamad Ariff
Ali, Ourdjini
Saliza Azlina, Osman
author_facet Siti Rabiatull Aisha, Idris
Azmah Hanim, Mohamad Ariff
Ali, Ourdjini
Saliza Azlina, Osman
author_sort Siti Rabiatull Aisha, Idris
title Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
title_short Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
title_full Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
title_fullStr Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
title_full_unstemmed Thermal Cyclic Test for Sn-4Ag-0.5Cu Solders on High P Ni/Au and Ni/Pd/Au Surface Finishes
title_sort thermal cyclic test for sn-4ag-0.5cu solders on high p ni/au and ni/pd/au surface finishes
publisher Faculty Mechanical Engineering, UMP
publishDate 2015
url http://umpir.ump.edu.my/id/eprint/16200/
http://umpir.ump.edu.my/id/eprint/16200/
http://umpir.ump.edu.my/id/eprint/16200/1/IJCAT%2052%284%29%20Paper%206_2015_kak%20azmah.pdf
first_indexed 2023-09-18T22:21:40Z
last_indexed 2023-09-18T22:21:40Z
_version_ 1777415697504141312

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