Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy

This research was carried out to investigate the effects of sintering temperature on the properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy by varying the temperatures. The Sn-4.0Ag-0.5Cu-1.0Ni solder alloy was prepared by using powder metallurgy method by press and sinter routes. 99.9% of pure Sn, Ag,...

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Main Authors: Siti Rabiatull Aisha, Idris, Nadhrah, Murad, M., Ishak
Format: Conference or Workshop Item
Language:English
English
Published: IEEE 2016
Subjects:
Online Access:http://umpir.ump.edu.my/id/eprint/16233/
http://umpir.ump.edu.my/id/eprint/16233/
http://umpir.ump.edu.my/id/eprint/16233/1/PAPER%20%2376%20IEMT%202016_NADHRAH%20MURAD.pdf
http://umpir.ump.edu.my/id/eprint/16233/7/effects%20of%20sintering1.pdf
id ump-16233
recordtype eprints
spelling ump-162332018-01-15T07:31:14Z http://umpir.ump.edu.my/id/eprint/16233/ Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy Siti Rabiatull Aisha, Idris Nadhrah, Murad M., Ishak Q Science (General) This research was carried out to investigate the effects of sintering temperature on the properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy by varying the temperatures. The Sn-4.0Ag-0.5Cu-1.0Ni solder alloy was prepared by using powder metallurgy method by press and sinter routes. 99.9% of pure Sn, Ag, Cu and Ni powder were used in this research where the pre-mixed powder undergoing milling process for 6 hours using a planetary ball machine. Hydraulic press machine was used to compact the solder powder at identically 5 tons(125 bars) for all samples. Five different temperatures of sintering specifically at 120℃, 150℃, 180℃, 220℃ and 250℃ were used. Characterizations on the microstructures such as grain size, thickness of intermetallic compound and, wettability angle were carried out using Scanning Electron Microscopy. Meanwhile, properties of the solder alloy were also evaluated through hardness and tensile test. It is expected that sintering process could be able to improve the strength of the solder joint by decreasing the intermetallic compound grain size. So far, most papers commonly used 180℃ as their sintering parameter without anyone providing the promising findings and various effects of the temperature onto solder. Therefore, this work is conducted to make a clarification and be the pilot study for the next sintering works for soldering. This paper reports experimental results of properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy at different sintering temperatures. IEEE 2016-12-01 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/16233/1/PAPER%20%2376%20IEMT%202016_NADHRAH%20MURAD.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/16233/7/effects%20of%20sintering1.pdf Siti Rabiatull Aisha, Idris and Nadhrah, Murad and M., Ishak (2016) Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy. In: 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference, 20-22 September 2016 , Penang, Malaysia. pp. 1-7.. https://doi.org/10.1109/IEMT.2016.7761946
repository_type Digital Repository
institution_category Local University
institution Universiti Malaysia Pahang
building UMP Institutional Repository
collection Online Access
language English
English
topic Q Science (General)
spellingShingle Q Science (General)
Siti Rabiatull Aisha, Idris
Nadhrah, Murad
M., Ishak
Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
description This research was carried out to investigate the effects of sintering temperature on the properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy by varying the temperatures. The Sn-4.0Ag-0.5Cu-1.0Ni solder alloy was prepared by using powder metallurgy method by press and sinter routes. 99.9% of pure Sn, Ag, Cu and Ni powder were used in this research where the pre-mixed powder undergoing milling process for 6 hours using a planetary ball machine. Hydraulic press machine was used to compact the solder powder at identically 5 tons(125 bars) for all samples. Five different temperatures of sintering specifically at 120℃, 150℃, 180℃, 220℃ and 250℃ were used. Characterizations on the microstructures such as grain size, thickness of intermetallic compound and, wettability angle were carried out using Scanning Electron Microscopy. Meanwhile, properties of the solder alloy were also evaluated through hardness and tensile test. It is expected that sintering process could be able to improve the strength of the solder joint by decreasing the intermetallic compound grain size. So far, most papers commonly used 180℃ as their sintering parameter without anyone providing the promising findings and various effects of the temperature onto solder. Therefore, this work is conducted to make a clarification and be the pilot study for the next sintering works for soldering. This paper reports experimental results of properties of Sn-4.0Ag-0.5Cu-1.0Ni solder alloy at different sintering temperatures.
format Conference or Workshop Item
author Siti Rabiatull Aisha, Idris
Nadhrah, Murad
M., Ishak
author_facet Siti Rabiatull Aisha, Idris
Nadhrah, Murad
M., Ishak
author_sort Siti Rabiatull Aisha, Idris
title Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
title_short Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
title_full Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
title_fullStr Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
title_full_unstemmed Effects of Sintering Temperatures on Microstructures and Mechanical Properties of Sn4.0Ag0.5Cu1.0Ni Solder Alloy
title_sort effects of sintering temperatures on microstructures and mechanical properties of sn4.0ag0.5cu1.0ni solder alloy
publisher IEEE
publishDate 2016
url http://umpir.ump.edu.my/id/eprint/16233/
http://umpir.ump.edu.my/id/eprint/16233/
http://umpir.ump.edu.my/id/eprint/16233/1/PAPER%20%2376%20IEMT%202016_NADHRAH%20MURAD.pdf
http://umpir.ump.edu.my/id/eprint/16233/7/effects%20of%20sintering1.pdf
first_indexed 2023-09-18T22:21:43Z
last_indexed 2023-09-18T22:21:43Z
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