A Review on Effect of Nickel Doping on Solder Joint Reliability

Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board dama...

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Main Authors:	Siti Rabiatull Aisha, Idris, Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar
Format:	Conference or Workshop Item
Language:	English
Published:	2015
Subjects:	Q Science (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/16238/ http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf

id	ump-16238
recordtype	eprints
spelling	ump-162382018-01-15T07:38:18Z http://umpir.ump.edu.my/id/eprint/16238/ A Review on Effect of Nickel Doping on Solder Joint Reliability Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Q Science (General) Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board damage. When an electronic product drops on the ground, the impact force and deformation which is transferred internally to the print circuit board (PCB) can cause brittle fracture at the solder joint interface or by impact ±8.tigue in the solder materials. Thus, in order to further enhance the mechanical properties of the solder joints, doping an element such as such as rare earth, Bi, Sb, Fe, Co, Cr, :Mn, Ti, In, Ni, and Ge as alloying addition has been selected in previous researchers as one of those solutions. This paper summarizes the effect of Ni doping element on intermetallic compound (IMC) formation, interfacial reaction and solders joint reliability. These reviews should provide an important basis of understanding the development of lead-free solders with addition of alloying elements. 2015-01 Conference or Workshop Item NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf Siti Rabiatull Aisha, Idris and Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar (2015) A Review on Effect of Nickel Doping on Solder Joint Reliability. In: National Conference for Postgraduate Research (NCON-PGR 2015), 24-25 January 2015 , Universiti Malaysia Pahang (UMP). pp. 1-16..
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	Q Science (General)
spellingShingle	Q Science (General) Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar A Review on Effect of Nickel Doping on Solder Joint Reliability
description	Currently, the demands for portable electronic gadgets such as Personal Digital Assistant, tablets and smart phone have increased due to its light weight and multifunctionality. But the major drawbacks of these portable devices are prone to accidental drops and may cause internal circuit board damage. When an electronic product drops on the ground, the impact force and deformation which is transferred internally to the print circuit board (PCB) can cause brittle fracture at the solder joint interface or by impact ±8.tigue in the solder materials. Thus, in order to further enhance the mechanical properties of the solder joints, doping an element such as such as rare earth, Bi, Sb, Fe, Co, Cr, :Mn, Ti, In, Ni, and Ge as alloying addition has been selected in previous researchers as one of those solutions. This paper summarizes the effect of Ni doping element on intermetallic compound (IMC) formation, interfacial reaction and solders joint reliability. These reviews should provide an important basis of understanding the development of lead-free solders with addition of alloying elements.
format	Conference or Workshop Item
author	Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar
author_facet	Siti Rabiatull Aisha, Idris Zetty Akhtar, Abd Malek Hardinnawirda, Kahar
author_sort	Siti Rabiatull Aisha, Idris
title	A Review on Effect of Nickel Doping on Solder Joint Reliability
title_short	A Review on Effect of Nickel Doping on Solder Joint Reliability
title_full	A Review on Effect of Nickel Doping on Solder Joint Reliability
title_fullStr	A Review on Effect of Nickel Doping on Solder Joint Reliability
title_full_unstemmed	A Review on Effect of Nickel Doping on Solder Joint Reliability
title_sort	review on effect of nickel doping on solder joint reliability
publishDate	2015
url	http://umpir.ump.edu.my/id/eprint/16238/ http://umpir.ump.edu.my/id/eprint/16238/1/fkm-2015-zetty-Review%20on%20Effect%20of%20Nickel%20Doping%20on%20Solder%20Joint%20Reliability.pdf
first_indexed	2023-09-18T22:21:44Z
last_indexed	2023-09-18T22:21:44Z
_version_	1777415701778137088

A Review on Effect of Nickel Doping on Solder Joint Reliability

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