Analysis of liquid film flow in between two different plates

In flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the...

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Main Author:	Wan Mohd Hasrol, Wan Hasan
Format:	Undergraduates Project Papers
Language:	English English English English
Published:	2016
Subjects:	Q Science (General) TS Manufactures
Online Access:	http://umpir.ump.edu.my/id/eprint/16241/ http://umpir.ump.edu.my/id/eprint/16241/ http://umpir.ump.edu.my/id/eprint/16241/1/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Table%20of%20contents-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/2/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Abstract-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/3/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Chapter%201-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/12/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-References-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf

id	ump-16241
recordtype	eprints
spelling	ump-162412017-01-20T08:01:31Z http://umpir.ump.edu.my/id/eprint/16241/ Analysis of liquid film flow in between two different plates Wan Mohd Hasrol, Wan Hasan Q Science (General) TS Manufactures In flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the solder bump and electrical failure resulting from thermal fatigue. This project focuses on analysis liquid film flow in between two different plates. The filling time will be analyzed to estimate the flow behavior between two parallel plates and flow pattern of liquid to fulfill entire plate. This experimnet uses four different materials which glass, perspex, aluminum and tile with dimension 25mm x 25mm for lower plates. For upper plate is fixed by using glass also with dimension 25mm x 25mm. Software Free Video to JPG Converter used to identify the time taken to fulfill and software Adobe Photoshop to calculate the distance travelled of liquid and to visualize the flow pattern during to fulfill entire plate. Glass-tile present high filling time due to its properties of surface roughness and under 300s of filling time, materials with lowest surface roughness travelled in longest distance. 2016-06 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/16241/1/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Table%20of%20contents-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/16241/2/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Abstract-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/16241/3/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Chapter%201-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf application/pdf en http://umpir.ump.edu.my/id/eprint/16241/12/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-References-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf Wan Mohd Hasrol, Wan Hasan (2016) Analysis of liquid film flow in between two different plates. Faculty of Manufacturing Engineering, Universiti Malaysia Pahang. http://iportal.ump.edu.my/lib/item?id=chamo:98454&theme=UMP2
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English English English English
topic	Q Science (General) TS Manufactures
spellingShingle	Q Science (General) TS Manufactures Wan Mohd Hasrol, Wan Hasan Analysis of liquid film flow in between two different plates
description	In flip chip technology, analysis of underfill flow between chip and substrate are important to prevent the chip from breaking. In other words, the welded solder balls in the packaged chip, underfill epoxy is filled into the gap between a chip and a substrate. It is because to prevent cracks on the solder bump and electrical failure resulting from thermal fatigue. This project focuses on analysis liquid film flow in between two different plates. The filling time will be analyzed to estimate the flow behavior between two parallel plates and flow pattern of liquid to fulfill entire plate. This experimnet uses four different materials which glass, perspex, aluminum and tile with dimension 25mm x 25mm for lower plates. For upper plate is fixed by using glass also with dimension 25mm x 25mm. Software Free Video to JPG Converter used to identify the time taken to fulfill and software Adobe Photoshop to calculate the distance travelled of liquid and to visualize the flow pattern during to fulfill entire plate. Glass-tile present high filling time due to its properties of surface roughness and under 300s of filling time, materials with lowest surface roughness travelled in longest distance.
format	Undergraduates Project Papers
author	Wan Mohd Hasrol, Wan Hasan
author_facet	Wan Mohd Hasrol, Wan Hasan
author_sort	Wan Mohd Hasrol, Wan Hasan
title	Analysis of liquid film flow in between two different plates
title_short	Analysis of liquid film flow in between two different plates
title_full	Analysis of liquid film flow in between two different plates
title_fullStr	Analysis of liquid film flow in between two different plates
title_full_unstemmed	Analysis of liquid film flow in between two different plates
title_sort	analysis of liquid film flow in between two different plates
publishDate	2016
url	http://umpir.ump.edu.my/id/eprint/16241/ http://umpir.ump.edu.my/id/eprint/16241/ http://umpir.ump.edu.my/id/eprint/16241/1/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Table%20of%20contents-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/2/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Abstract-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/3/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-Chapter%201-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf http://umpir.ump.edu.my/id/eprint/16241/12/Analysis%20of%20liquid%20film%20flow%20in%20between%20two%20different%20plates-References-FKP-Wan%20Mohd%20Hasrol%20Wan%20Hasan-CD%2010448.pdf
first_indexed	2023-09-18T22:21:44Z
last_indexed	2023-09-18T22:21:44Z
_version_	1777415702075932672

Analysis of liquid film flow in between two different plates

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