Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy

The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method. They were cooled by different cooling medium such as slow (furnace cooling), normal (air cooling) and fast...

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Main Authors:	Siti Rabiatull Aisha, Idris, Nadhrah, Murad, M., Ishak
Format:	Article
Language:	English
Published:	Elsevier Ltd 2017
Subjects:	Q Science (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/1/Jurnal%20Procedia%20Engineering_Nadhrah.pdf

id	ump-17663
recordtype	eprints
spelling	ump-176632018-01-15T07:28:48Z http://umpir.ump.edu.my/id/eprint/17663/ Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy Siti Rabiatull Aisha, Idris Nadhrah, Murad M., Ishak Q Science (General) The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method. They were cooled by different cooling medium such as slow (furnace cooling), normal (air cooling) and fast (water cooling) which was 0.0076°C/s, 0.73°C/s and 31.14°C/s, respectively. Characterisation for each sample was conducted to examine the intermetallic compound formation and solder shear strength. Result indicated that faster cooling rates decreased the IMC thickness but reduced the solder joint strength due to distribution of melted solder on Cu board. This study found that the shape of Cu6Sn5 and Ag3Sn changed according to cooling rates either at the interfacial or in the solder matrix. The study on comparison between three different cooling rates onto properties of Sn3.8Ag0.7Cu solder alloy prepared by PM method is still unknown and the current findings are still unclear. Thus this research would be the fundamental study to investigate the effects of cooling rates onto behaviours of the solder alloy. It is believed that more attentions will be shown onto this superior topic to increase the level of promising reliability of solder alloy in industry and marketplaces. Elsevier Ltd 2017-05-02 Article PeerReviewed application/pdf en cc_by_nc_nd http://umpir.ump.edu.my/id/eprint/17663/1/Jurnal%20Procedia%20Engineering_Nadhrah.pdf Siti Rabiatull Aisha, Idris and Nadhrah, Murad and M., Ishak (2017) Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy. Procedia Engineering, 184. pp. 266-273. ISSN 1877-7058 https://doi.org/10.1016/j.proeng.2017.04.094 doi: 10.1016/j.proeng.2017.04.094
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	Q Science (General)
spellingShingle	Q Science (General) Siti Rabiatull Aisha, Idris Nadhrah, Murad M., Ishak Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
description	The aim of this research paper is to study the effects of cooling rates on microstructure and mechanical properties of Sn3.8Ag0.7Cu solder alloy prepared through powder metallurgy (PM) method. They were cooled by different cooling medium such as slow (furnace cooling), normal (air cooling) and fast (water cooling) which was 0.0076°C/s, 0.73°C/s and 31.14°C/s, respectively. Characterisation for each sample was conducted to examine the intermetallic compound formation and solder shear strength. Result indicated that faster cooling rates decreased the IMC thickness but reduced the solder joint strength due to distribution of melted solder on Cu board. This study found that the shape of Cu6Sn5 and Ag3Sn changed according to cooling rates either at the interfacial or in the solder matrix. The study on comparison between three different cooling rates onto properties of Sn3.8Ag0.7Cu solder alloy prepared by PM method is still unknown and the current findings are still unclear. Thus this research would be the fundamental study to investigate the effects of cooling rates onto behaviours of the solder alloy. It is believed that more attentions will be shown onto this superior topic to increase the level of promising reliability of solder alloy in industry and marketplaces.
format	Article
author	Siti Rabiatull Aisha, Idris Nadhrah, Murad M., Ishak
author_facet	Siti Rabiatull Aisha, Idris Nadhrah, Murad M., Ishak
author_sort	Siti Rabiatull Aisha, Idris
title	Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
title_short	Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
title_full	Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
title_fullStr	Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
title_full_unstemmed	Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy
title_sort	effects of cooling rates on microstructure, wettability and strength of sn3.8ag0.7cu solder alloy
publisher	Elsevier Ltd
publishDate	2017
url	http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/ http://umpir.ump.edu.my/id/eprint/17663/1/Jurnal%20Procedia%20Engineering_Nadhrah.pdf
first_indexed	2023-09-18T22:24:32Z
last_indexed	2023-09-18T22:24:32Z
_version_	1777415878190563328

Effects of Cooling Rates on Microstructure, Wettability and Strength of Sn3.8Ag0.7Cu Solder Alloy

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