APA (7th ed.) Citation

Ariff Syakirin, G. (2007). Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures.

Chicago Style (17th ed.) Citation

Ariff Syakirin, Ghazalli. Joint Solder of Lead Free Solder (Sn0.7Cu) and Prrinted Circuit Board with Various Heat Treatment Temperatures. 2007.

MLA (8th ed.) Citation

Ariff Syakirin, Ghazalli. Joint Solder of Lead Free Solder (Sn0.7Cu) and Prrinted Circuit Board with Various Heat Treatment Temperatures. 2007.

Warning: These citations may not always be 100% accurate.