Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.

This paper presents the effect of diffferent parameters of fibre laser soldering on interfacial reaction of two types of lead-free solder fabrication on Cu pad. The objective of this paper is to study the intermetallic compound thickness (IMC) formation and wetting angle of two different types of so...

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Main Authors:	Siti Rabiatull Aisha, Idris, Nabila, T. J., M., Ishak
Format:	Conference or Workshop Item
Language:	English
Published:	Universiti Malaysia Pahang 2018
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/24270/ http://umpir.ump.edu.my/id/eprint/24270/1/43.1%20Effect%20of%20different%20parameters%20of%20fibre%20laser%20soldering.pdf

id	ump-24270
recordtype	eprints
spelling	ump-242702019-08-22T06:14:29Z http://umpir.ump.edu.my/id/eprint/24270/ Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad. Siti Rabiatull Aisha, Idris Nabila, T. J. M., Ishak TJ Mechanical engineering and machinery This paper presents the effect of diffferent parameters of fibre laser soldering on interfacial reaction of two types of lead-free solder fabrication on Cu pad. The objective of this paper is to study the intermetallic compound thickness (IMC) formation and wetting angle of two different types of solder fabrication when it were exposed to varies of laser power and scanning time. A fibre laser with 200W continues wave (CW) was used in this experiment to form a joining between SAC305 solder wire and printed copper board. A continuous laser power was ranged between 72W to 88W and scanning time of 1.5s and 2.5s were chosen to create joining. Flux was used in the laser soldering experiment in order to gain uniform heat distribution throughout the solders. The mechanical properties were observed by using optical and metallurgical microscope. Results showed that SAC305 solder powder performing good wetting angle and has more thinner IMC layer compared to SAC305 solder wire. Universiti Malaysia Pahang 2018-10 Conference or Workshop Item PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/24270/1/43.1%20Effect%20of%20different%20parameters%20of%20fibre%20laser%20soldering.pdf Siti Rabiatull Aisha, Idris and Nabila, T. J. and M., Ishak (2018) Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad. In: International Postgraduate Conference On Mechanical Engineering, 31 Oktober 2018 , Universiti Malaysia Pahang, Pekan. p. 1.. (Unpublished)
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Siti Rabiatull Aisha, Idris Nabila, T. J. M., Ishak Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
description	This paper presents the effect of diffferent parameters of fibre laser soldering on interfacial reaction of two types of lead-free solder fabrication on Cu pad. The objective of this paper is to study the intermetallic compound thickness (IMC) formation and wetting angle of two different types of solder fabrication when it were exposed to varies of laser power and scanning time. A fibre laser with 200W continues wave (CW) was used in this experiment to form a joining between SAC305 solder wire and printed copper board. A continuous laser power was ranged between 72W to 88W and scanning time of 1.5s and 2.5s were chosen to create joining. Flux was used in the laser soldering experiment in order to gain uniform heat distribution throughout the solders. The mechanical properties were observed by using optical and metallurgical microscope. Results showed that SAC305 solder powder performing good wetting angle and has more thinner IMC layer compared to SAC305 solder wire.
format	Conference or Workshop Item
author	Siti Rabiatull Aisha, Idris Nabila, T. J. M., Ishak
author_facet	Siti Rabiatull Aisha, Idris Nabila, T. J. M., Ishak
author_sort	Siti Rabiatull Aisha, Idris
title	Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
title_short	Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
title_full	Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
title_fullStr	Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
title_full_unstemmed	Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.
title_sort	effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free sac305 solder fabrication on cu pad.
publisher	Universiti Malaysia Pahang
publishDate	2018
url	http://umpir.ump.edu.my/id/eprint/24270/ http://umpir.ump.edu.my/id/eprint/24270/1/43.1%20Effect%20of%20different%20parameters%20of%20fibre%20laser%20soldering.pdf
first_indexed	2023-09-18T22:36:37Z
last_indexed	2023-09-18T22:36:37Z
_version_	1777416638667161600

Effect of different parameters of fibre laser soldering on interfacial reaction and wetting angle of two types of lead-free SAC305 solder fabrication on cu pad.

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