Effect of heat treatment temperature on SN-0.7CU solders material on microstructure

Soldering plays the most important role for joining technology in electronic industry.The conventional tin-lead solders have been used for a quite long time in electronic industries.However,since lead is a toxic element and harmful to individual health and environment,many researchers have proposed...

Full description

Bibliographic Details
Main Author:	Nabhan, Ismail
Format:	Undergraduates Project Papers
Language:	English
Published:	2007
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://umpir.ump.edu.my/id/eprint/5152/ http://umpir.ump.edu.my/id/eprint/5152/ http://umpir.ump.edu.my/id/eprint/5152/1/NABHAN_BIN_ISMIL.PDF

id	ump-5152
recordtype	eprints
spelling	ump-51522015-03-03T09:23:23Z http://umpir.ump.edu.my/id/eprint/5152/ Effect of heat treatment temperature on SN-0.7CU solders material on microstructure Nabhan, Ismail TA Engineering (General). Civil engineering (General) Soldering plays the most important role for joining technology in electronic industry.The conventional tin-lead solders have been used for a quite long time in electronic industries.However,since lead is a toxic element and harmful to individual health and environment,many researchers have proposed lead-free solder to protect individual health and environment as well.The objective of this study is to analyze the microstructure at the solder and base metal interface.This study investigates the interfacial reactions between Sn-0.7Cu solder material and copper substrate before and after aging at 100°C, 150°C and 200°C for 1 hour,3 hours and hours.Copper substrates are connected to each other by manual soldering.After soldering, the intermetallic compound formed at the interface is Cu6Sn5 intermetallic compound.The thickness of the intermetallic compound increases as the aging time and temperature increased. Intermetallic compound layer must be keep at sufficient thickness because excessive amount of intermetallic compound can generate defect and affect the solder joint reliability. 2007-11 Undergraduates Project Papers NonPeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/5152/1/NABHAN_BIN_ISMIL.PDF Nabhan, Ismail (2007) Effect of heat treatment temperature on SN-0.7CU solders material on microstructure. Faculty of Mechanical Engineering , Universiti Malaysia Pahang. http://iportal.ump.edu.my/lib/item?id=chamo:30997&theme=UMP2
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TA Engineering (General). Civil engineering (General)
spellingShingle	TA Engineering (General). Civil engineering (General) Nabhan, Ismail Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
description	Soldering plays the most important role for joining technology in electronic industry.The conventional tin-lead solders have been used for a quite long time in electronic industries.However,since lead is a toxic element and harmful to individual health and environment,many researchers have proposed lead-free solder to protect individual health and environment as well.The objective of this study is to analyze the microstructure at the solder and base metal interface.This study investigates the interfacial reactions between Sn-0.7Cu solder material and copper substrate before and after aging at 100°C, 150°C and 200°C for 1 hour,3 hours and hours.Copper substrates are connected to each other by manual soldering.After soldering, the intermetallic compound formed at the interface is Cu6Sn5 intermetallic compound.The thickness of the intermetallic compound increases as the aging time and temperature increased. Intermetallic compound layer must be keep at sufficient thickness because excessive amount of intermetallic compound can generate defect and affect the solder joint reliability.
format	Undergraduates Project Papers
author	Nabhan, Ismail
author_facet	Nabhan, Ismail
author_sort	Nabhan, Ismail
title	Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
title_short	Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
title_full	Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
title_fullStr	Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
title_full_unstemmed	Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
title_sort	effect of heat treatment temperature on sn-0.7cu solders material on microstructure
publishDate	2007
url	http://umpir.ump.edu.my/id/eprint/5152/ http://umpir.ump.edu.my/id/eprint/5152/ http://umpir.ump.edu.my/id/eprint/5152/1/NABHAN_BIN_ISMIL.PDF
first_indexed	2023-09-18T22:00:22Z
last_indexed	2023-09-18T22:00:22Z
_version_	1777414357349564416

Effect of heat treatment temperature on SN-0.7CU solders material on microstructure

Similar Items