Effect Of Solder Volume on Interfacial Reaction Between SAC405 Solders and EN(B)EPIG Surface Finish
The electronic packaging industry is now being driven towards smaller, lighter, and thinner electronic products but with higher performance and more functions. Thus, smaller solder ball sizes are needed for fine solder joint interconnections to fulfill these requirements. This study investigates...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2014
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/ http://umpir.ump.edu.my/id/eprint/5201/1/AMR.845.76_%28mimec2013%29_kak_ija_for_skt2014.pdf |