APA (7th ed.) Citation

Siti Rabiatull Aisha, I., Ali, O., & Y. T., C. (2012). Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation during Soldering on Copper.

Chicago Style (17th ed.) Citation

Siti Rabiatull Aisha, Idris, Ourdjini Ali, and Chin Y. T. Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation During Soldering on Copper. 2012.

MLA (8th ed.) Citation

Siti Rabiatull Aisha, Idris, et al. Effect of Nickel Addition into Sn-3Ag-0.5Cu on Intermetallic Compound Formation During Soldering on Copper. 2012.