Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Add...

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Main Authors:	Zetty Akhtar, Abd Malek, Hardinnawirda, Kahar, Siti Rabiatull Aisha, Idris, M., Ishak
Format:	Conference or Workshop Item
Language:	English
Published:	2014
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://umpir.ump.edu.my/id/eprint/6710/ http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF

id	ump-6710
recordtype	eprints
spelling	ump-67102018-01-18T06:40:16Z http://umpir.ump.edu.my/id/eprint/6710/ Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak TJ Mechanical engineering and machinery The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Adding the doping elements such as nickel will further enhance the properties of the intermetallic compounds. This study aims to examine theintermetallic compounds properties with different nickel doping value (0.05, 0.25 and 0.50) weight percent (wt%) and find the optimum value for nickel addition in order to improve solder joint reliability.In order to obtain the intermetallic compound desired, the Sn-Cu solder were melted with Cu with weight ratio 50:50 and additional nickel doping at 1000°C. The microstructure of the mixture were observed using Scanning Electron Microscope.Mechanical properties of intermetallic compound formed were then evaluated using lap shear test and Vickers hardness test.The results show that the types of intermetallic compounds formed and ultimate tensile strength were affected significantly by the weight percentages of nickel addition. 2014 Conference or Workshop Item PeerReviewed application/pdf en http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF Zetty Akhtar, Abd Malek and Hardinnawirda, Kahar and Siti Rabiatull Aisha, Idris and M., Ishak (2014) Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy. In: International Conference on Electronics Packaging, 23-25 April 2014 , Jepun. .
repository_type	Digital Repository
institution_category	Local University
institution	Universiti Malaysia Pahang
building	UMP Institutional Repository
collection	Online Access
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
description	The effect of nickel addition towards the intermetallic compound properties that formed between Sn-Cu solder alloy and Cu substrate were investigated in this study. Since the intermetallic compounds generally have brittle nature and its thick formation could lead to serious reliability concerns.Adding the doping elements such as nickel will further enhance the properties of the intermetallic compounds. This study aims to examine theintermetallic compounds properties with different nickel doping value (0.05, 0.25 and 0.50) weight percent (wt%) and find the optimum value for nickel addition in order to improve solder joint reliability.In order to obtain the intermetallic compound desired, the Sn-Cu solder were melted with Cu with weight ratio 50:50 and additional nickel doping at 1000°C. The microstructure of the mixture were observed using Scanning Electron Microscope.Mechanical properties of intermetallic compound formed were then evaluated using lap shear test and Vickers hardness test.The results show that the types of intermetallic compounds formed and ultimate tensile strength were affected significantly by the weight percentages of nickel addition.
format	Conference or Workshop Item
author	Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak
author_facet	Zetty Akhtar, Abd Malek Hardinnawirda, Kahar Siti Rabiatull Aisha, Idris M., Ishak
author_sort	Zetty Akhtar, Abd Malek
title	Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
title_short	Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
title_full	Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
title_fullStr	Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
title_full_unstemmed	Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
title_sort	effect of nickel addition on intermetallic compound properties of sn-cu solder alloy
publishDate	2014
url	http://umpir.ump.edu.my/id/eprint/6710/ http://umpir.ump.edu.my/id/eprint/6710/1/Effect_of_Nickel_addition_on_Intermetallic_Compound_Properties_of_Sn-Cu_Solder_Alloy.PDF
first_indexed	2023-09-18T22:02:42Z
last_indexed	2023-09-18T22:02:42Z
_version_	1777414504587460608

Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy

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