Different coating type on copper substrate
This thesis will deal with the effect of different coating types on solder joint strength, specifically on intermetallic compound (IMC). Coating is essential in printed circuit board application since it can protect the base material, which is Copper, from oxidation and degradation. However, the coa...
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| Format: | Undergraduates Project Papers |
| Language: | English |
| Published: |
2013
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| Online Access: | http://umpir.ump.edu.my/id/eprint/8453/ http://umpir.ump.edu.my/id/eprint/8453/ http://umpir.ump.edu.my/id/eprint/8453/1/cd8148.pdf |