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Hardinnawirda, Kahar
AND
M., Ishak
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Universiti Malaysia Pahang
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Author:
Hardinnawirda, Kahar
AND
M., Ishak
Institution:
Universiti Malaysia Pahang
Repository Type:
Digital Repository
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1
Deposition of Electroless Nickel Boron as Printed Circuit Board Surface Finish
by
Hardinnawirda, Kahar
,
Zetty Akhtar, Abd Malek
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2016
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2
Effect of Cooling and Isothermal Aging on Microstructure Using Electroless Nickel (Boron) Plating
by
Hardinnawirda, Kahar
,
Zetty Akhtar, Abd Malek
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2015
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3
Microstructure Evolution at the Solder Joint During Isothermal Aging
by
Zetty Akhtar, Abd Malek
,
Hardinnawirda, Kahar
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2014
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4
Effect of Immersion Coating Deposition Time on Solder Joint Properties
by
Zetty Akhtar, Abd Malek
,
Hardinnawirda, Kahar
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2016
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5
Intermetallic Growth and Shear Strength of SAC305/EN-Boron
by
Hardinnawirda, Kahar
,
Zetty Akhtar, Abd Malek
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2016
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6
Influence of Second Reflow on the Intermetallic Compound Growth with Different Surface Finish
by
Hardinnawirda, Kahar
,
Zetty Akhtar, Abd Malek
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2016
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7
Effect of Nickel addition on Intermetallic Compound Properties of Sn-Cu Solder Alloy
by
Zetty Akhtar, Abd Malek
,
Hardinnawirda, Kahar
,
Siti Rabiatull Aisha, Idris
,
M., Ishak
Published 2014
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Hardinnawirda, Kahar
M., Ishak
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