The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Saliza Azlina, Osman
Published 2016

Rheological behavior and stability of cassava starch for ceramic mould binder application

by Alias, Tuti Yasmin, Idris, Mohd Hasbullah, Ahmad, Zuraida, Ourdjini, Ali
Published 2012

Development of Diffusion Barrier Layer on Copper-Printed Circuit Board Using Electroless Plating Method

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2015

Intermetallic Evolution for Isothermal Aging up to 2000 Hours on Sn-4Ag-0.5Cu and Sn-37Pb Solders with Ni/Au Layers

by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman, Siti Rabiatull Aisha, Idris
Published 2013

Effect of Reflow Soldering Profile on Intermetallic Compound Formation

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2015

Thermal Cyclic Test For Sn-4Ag-0.5Cu Solders On High P Ni/Au AND Ni/Pd/Au Surface Finishes

by Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Siti Rabiatull Aisha, Idris, Saliza Azlina, Osman
Published 2015

Intermetallic Evolution for Isothermal Aging Up To 2000hours on Sn-4ag-0.5cu and Sn-37pb Solders with Ni/Au Layers

by Siti Rabiatull Aisha, Idris, Azmah Hanim, Mohamad Ariff, Ourdjini, Ali, Saliza Azlina, Osman
Published 2013

Adhesion Strength of HFCVD Diamond Coating on WC Substrate Seeded with Diamond and Different Ratios of SiC Powders

by Mas Ayu, Hassan, Engku Mohammad, Nazim, Sudin, Izman, Ourdjini, Ali, Tuty, Abu Bakar
Published 2014

Effect of Reflow Profile on Intermetallic Compound Formation

by Siti Rabiatull Aisha, Idris, Ourdjini, Ali, Azmah Hanim, Mohamad Ariff, Saliza Azlina, Osman
Published 2013