Fatigue failure processes in pb-free solder joints using continuum damage and cohesive zone models

by Shaffiar, Norhashimah, Yamin, A.F.M., Loh, W.K., Tamin, M.N.
Published 2012

Damage progression in BGA solder joints during board-level drop test

by Yamin, A.F.M., Shaffiar, Norhashimah, Loh, W.K., Tamin, M.N.
Published 2011

Extended cohesive zone model for simulation of solder/IMC interface cyclic damage process in pb-free solder interconnects

by Yamin, A.F.M., Shaffiar, N.M., Loh, W.K., Tamin, M.N.
Published 2012