Development of an economical lapping process
The manufacturing of silicon wafers in particular involves numerous processes such as grinding, lapping, and polishing of large diameter wafers employing expensive equipment in order to produce the required optical quality and damage-free surfaces. In the finishing of thin silicon chips for making I...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2012
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/28463/ http://irep.iium.edu.my/28463/ http://irep.iium.edu.my/28463/2/DEVELOPMENT_OF_AN_ECONOMICAL_LAPPING_PROCESS.pdf |