Enhancing μ-wedming (wire electro-discharge machining) of polished silicon wafer by conductive coating
Micro-Wire Electro-discharge machining (-WEDM) is a nonconventional machining technology which is extensively used for metal based micro fabrication process. This is a non-contact machining process where material removal is taken place by electro-thermal action. -WEDM process is difficult to be ap...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nova Science Publisher
2014
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/ http://irep.iium.edu.my/37120/1/Vol5_1-2_JMTR.pdf |