Damage mechanics model for solder/intermetallics interface fracture process in solder joints

Damage mechanics model for solder/intermetallics interface fracture process in solder joints

The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fract...

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Bibliographic Details
Main Authors: Shaffiar, Norhashimah, Laib, Z. B., Tam, M. N.
Format: Article
Language:English
Published: Trans Tech Publications, Switzerland 2011
Subjects:
TA349 Mechanics of engineering. Applied mechanics
Online Access:http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf

Internet

http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/
http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf

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