Damage mechanics model for solder/intermetallics interface fracture process in solder joints
The relatively brittle solder/IMC interface fracture process in reflowed solder joints is examined using finite element (FE) method. The interface decohesion is described using a traction-separation quadratic failure criterion along with a mixed-mode displacement formulation for the interface fract...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications, Switzerland
2011
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| Subjects: | |
| Online Access: | http://irep.iium.edu.my/39037/ http://irep.iium.edu.my/39037/ http://irep.iium.edu.my/39037/1/KEM.462-463.1409_2011_Damage_Mechanics_Model_for_Solder-Intermetallics_Interface_Fracture_Process_in_Solder_Joints.pdf |